Orthohexagonal crystal silicon solar wafer and solar battery manufactured thereby

Abstract

The invention discloses an orthohexagonal crystal silicon solar wafer, which comprises an orthohexagonal silicon wafer, and the orthohexagonal silicon wafer is a sheet body formed by an inscribed regular hexagon of the cross section of a cylindrical crystal silicon rod. The invention also discloses a solar battery manufactured by the orthohexagonal crystal silicon solar wafer, and the orthohexagonal silicon wafer is manufactured into an orthohexagonal solar battery by adopting the manufacture process of a crystal silicon solar battery. The silicon wafer is orthohexagonal, so that the cut-off flaw-piece materials of the crystal silicon rod are greatly reduced, the utilization ratio of the crystal silicon rod is improved, the return quantity is reduced and the manufacturing cost is saved. The orthohexagonal solar battery has increased effective area and improved output power, realizes seamless splicing of battery components manufactured into the battery and the limited arrangement area of the components as far as possible, and satisfies the requirement for welding the battery components.

Description

technical field [0001] The invention relates to the technical field of photovoltaic utilization of crystalline silicon solar energy, in particular to a regular hexagonal crystalline silicon solar wafer and a solar cell made of the silicon wafer. Background technique [0002] In the manufacturing process of crystalline silicon solar silicon wafers and batteries, silicon is first made into cylindrical crystalline silicon rods by Czochralski or zone melting methods. In order to improve the efficiency of solar cell modules, silicon wafers need to cover the entire module area as much as possible. Therefore, the crystalline silicon rods also need to be made into rounded square silicon chips with a thickness of 150-200 μm through processes such as square rooting and slicing. The outer contour of each silicon chip is composed of four straight sides and rounded corners, commonly known as quasi-square. , Quasi-square silicon wafers are directly used to make solar cells, and then solar...

AI Technical Summary

Problems solved by technology

In the process of squaring, the excised part is used as the scrap material, which usually accounts for 15%-30% of the crystal silicon rod. At present, the processing of the scrap scrap is usually done by returning to the furnace and re-drawing. In fact, this This method increases the amount of reheating, which is a waste in disguise

[0004] China Utility Model Authorized Patent (Patent No. 201020032032.7) discloses a technical solution for cutting the finished solar cells to make regular hexagonal cells. However, this technical solution has the following defects: (1) The completed solar cells contain diffusion Impurities and electronic paste, the removed part will also be unable to be directly returned to the furnace because it contains diffused impurities and electronic paste, resulting in waste and not improving the utilization of silicon rods; (2) the removed part needs to be processed, thus improving production Cost; (3) Since the existing quasi-square cell is cut into a regular hexagon, the effective area of ​​a regular hexagonal cell is small, which reduces the output power of a single cell

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