Double-interfaced card packaging method and take-up clamp thereof

Abstract

The invention provides a double-interfaced card packaging method and a take-up clamp thereof. The double-interfaced card packaging method comprises the following steps of: milling an outer groove in a card base, so as to expose an antenna head of the double-interfaced card; taking up and pulling up an antenna from the card base through the heated take-up clamp; milling an inner-layer groove in the card base where the antenna is pulled up; and welding an outer welding plate of a module and the pulled antenna. The take-up clamp provided by the invention is provided with a heating and temperature control device, so that the antenna and the card base in the double-interfaced card base can be easily separated, and the antenna head is taken up from the card base; meanwhile, the contact time between a clamp head and the card base is very short, so that the take-up speed is improved; and the clamping force of the clamp head can be adjusted, the take-up process can be smoothly carried out, and the break problem in the take-up process can be avoided. With the adoption of the take-up technology provided by the invention, the current condition that no automatic take-up equipment exists in an intelligent card industry at home and aboard can be solved; the machining process can be simplified; the production efficiency is improved; the product property is improved; and the machining cost is greatly saved.

Description

technical field [0001] The invention relates to a packaging process for a dual-interface card, in particular to a packaging method for a dual-interface card and a wire pick-up clip. Background technique [0002] At present, with the development of science and technology, smart cards have been applied in various fields, and smart cards mainly include contact smart cards, contactless smart cards and dual-interface cards. Dual-interface card refers to a smart card that has both functions of contact smart card and contactless smart card; dual-interface card is more and more popular with people because of its comprehensive functions. [0003] The packaging of the dual interface card is to connect the antenna on the card base with the smart card chip to form a finished dual interface card. There are three main packaging processes for existing dual-interface cards: [0004] The first is a packaging method in which the dual-interface module and the card-based antenna are directly ...

AI Technical Summary

Problems solved by technology

This method is to use polymer conductive materials to connect the module with the antenna; although its production efficiency is high and the equipment is simple to implement, the conductive properties of the conductive adhesive itself will be attenuated in the later use, resulting in a short service life of the product, which cannot meet the requirements. The problem of product quality requirements; moreover, because the conductive adhesive is only in contact with the solder joints, and there is no strong connection, if the card is bent, it will cause poor contact between the conductive adhesive and the solder joints. In addition, as the card's use time increases, The contact effect will be worse after the conductive adhesive is aged

[0007] Through the comparison of the above three packaging methods, the first packaging method of directly soldering the dual-interface module and the card-based antenna is still the most reasonable dual-interface card packaging process, which has the advantages of reliable product quality, low packaging cost, The advantage of short process flow; however, the thread picking process is an important link in this method, and the effect of thread picking directly affects the production of subsequent processes. At present, the problems of easy thread breakage and high scrap rate in the thread picking process have been plagued Domestic and foreign manufacturers

Through analysis, it is known that since the antenna is embedded in the card base when picking up the thread, there is a large connection force (or adhesive force) between the antenna and the card base. When the operator picks up the thread with a knife or tweezers, it is Pull the antenna out directly, because the antenna is thinner and the connection force is stronger, so it is very easy to pull the antenna off

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