Organic light emitting diode and packaging effect detection method

Abstract

The invention provides an organic light emitting diode and a packaging effect detection method. The organic light emitting diode comprises a base plate, a cover plate and a seal layer arranged between the base plate and the cover plate, wherein a circle of seal layer is arranged along an edge part of an upper surface of the base plate in a closing way; the base plate, the cover plate and the seal layer jointly form a sealed cavity; a light emitting chip is arranged in the cavity; a test strip is arranged in the cavity; and test electrodes are respectively connected to two ends of the test strip, and penetrate through the seal layer so as to extend out of the cavity. Through measuring the variation of electrical resistivity of the test strip in an inert gas environment and exposed in air, the condition that whether oxygen and water enter into a packaging structure or not can be judged. The structure of the organic light emitting diode and the detection method are combined, so that whether a product is qualified or not can be quickly and accurately detected, the accuracy rate is high, the erroneous judgment is avoided, and the rate of finished products is improved.

Description

technical field [0001] The invention relates to an organic light-emitting diode and a detection method for encapsulation effect. Background technique [0002] The basic structure of existing organic light-emitting diodes is as follows figure 1 As shown, the light-emitting chip 9 is arranged on the substrate 1, and a sealing layer 3 is arranged on the edge of the substrate 1. The substrate 1 and the cover plate 2 are bonded together through the sealing layer 3, forming a sealed space between the substrate 1 and the cover plate 2. The cavity 11 is provided, and the light-emitting chip 9 is sealed in the cavity 11 . During the encapsulation process, due to insufficient process, thermal effect, temperature difference, material itself and other factors, the sealing effect of individual devices after encapsulation is not ideal, and cracks and pores will appear in the sealing layer 3, seriously affecting the bonding strength and sealing performance. When the above-mentioned quali...

AI Technical Summary

Problems solved by technology

For large-scale production, this manual detection method is not only inefficient, but also leads to misjudgment due to different judgment standards of different people, and the detection accuracy is low.

Ultimately lead to waste of resources, high cost, low overall yield, even if the product leaves the factory, there will be quality problems such as high failure rate and low service life

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