Sensitization-free chemical nickel-plating method of conducting glass
A conductive glass and electroless nickel plating technology, which is applied in the field of non-sensitized chemical nickel plating for conductive glass, can solve the problems of cumbersome steps, high cost of raw materials, high precision requirements of process conditions, etc., and achieve simplified pretreatment steps and high success rate , metal terminals and connecting lines with clear texture
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Embodiment 1
[0029] Implementation example 1: (1) degreasing at 25°C for 6 minutes, the formula of degreasing liquid is sodium carbonate 1.0%, sodium phosphate 1.0%, sodium hydroxide 0.5%, sodium lauryl sulfate 0.008%; (2) 25°C Roughening at low temperature for 5 minutes, the formula of the roughening solution is potassium hydrogen persulfate 1.0%, potassium persulfate 2.0%, potassium sulfate 5.0%, ethanol 1.5%, sulfuric acid 0.01%, acetic acid 0.4%; (3) Degumming at 25°C for 6 minutes , the degumming solution formula is 0.01% hydrochloric acid, 0.01% sulfuric acid; (4) Catalyzed at 25°C for 8 minutes, the catalytic solution formula is cuprous chloride 1.0%, cupric chloride 2.5%, succinic acid 1.0%, dodecane Sodium sulfite 0.01%; (5) Activation at 25°C for 6 minutes, the formula of the activation solution is sodium hypophosphite 0.1%, acetic acid 1.5%; (6) Electroless nickel plating at 80°C for 3 minutes, the formula of the electroless plating solution is hexahydrate Nickel sulfate 2.0%, t...
Embodiment 2
[0030]Implementation example 2: (1) degreasing at 35°C for 3 minutes, the formula of degreasing liquid is sodium carbonate 2.0%, sodium phosphate 2.0%, sodium hydroxide 0.1%, sodium lauryl sulfate 0.005%; (2) 35°C Roughen at high temperature for 3 minutes, the formula of roughening solution is 2.0% potassium persulfate, 2.0% potassium persulfate, 0.5% ethanol, 1.0% sulfuric acid, 0.2% formic acid; (3) Degumming at 35°C for 3 minutes, formula Nitric acid 0.05%, sulfuric acid 0.05%; (4) Catalyze at 35°C for 5 minutes, and the formula of the catalytic solution is 0.05% stannous chloride, 0.1% potassium chloride, 0.01% lactic acid, and 0.0001% sodium lauryl sulfate; ( 5) Activation at 35°C for 3 minutes, the formula of the activation solution is sodium hypophosphite 2.0%, 0.5% formic acid; (6) Electroless nickel plating at 65°C for 8 minutes, the formula of the electroless plating solution is nickel sulfate hexahydrate 2.5%, citric acid Trisodium 1.0%, succinic acid 1.0%, sodium h...
Embodiment 3
[0031] Implementation Example 3: (1) Oil removal at 30°C for 5 minutes, the oil removal liquid formula is 3.0% sodium carbonate, 0.1% sodium phosphate, 0.01% sodium hydroxide, 0.001% sodium lauryl sulfate; (2) 30°C Roughening at high temperature for 8 minutes, the formula of the roughening solution is potassium persulfate 3.5%, potassium sulfate 1.0%, ethanol 0.8%, sulfuric acid 0.05%, lactic acid 1.0%; (3) 30°C for 8 minutes, the formula of the degumming solution is Phosphoric acid 2.0%, sulfuric acid 1.0%; (4) Catalyze at 30°C for 3 minutes, the formula of the catalytic solution is silver nitrate 0.01%, sodium acetate 5.0%, acetic acid 0.05%, sodium lauryl sulfate 0.0005%; (5) 30°C Activation at low temperature for 8 minutes, the formula of the activation solution is sodium hypophosphite 1.0%, lactic acid 1.0%; (6) Electroless nickel plating at 70°C for 5 minutes, the formula of the electroless plating solution is 3.0% of nickel sulfate hexahydrate, 0.5% of lactic acid, butan...
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