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Sn-Zn lead-free solder containing Nd, Ga and Se

A lead-free solder, sn-zn technology, applied in the Sn-Zn lead-free solder of Se, containing Nd, Ga, can solve the problem of poor overall performance, solder cost, solder melting point gap, and poor wettability And other issues

Active Publication Date: 2015-03-25
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the representative lead-free solders include Sn-Ag-Cu, Sn-Cu, Sn-Cu-Ni and other alloy systems, each with its own strengths, but compared with tin-lead solders, the cost of solder, solder There is still a certain gap in terms of melting point, etc.
Sn-Zn solder melting point and raw material cost are lower than Sn-Ag-Cu, Sn-Cu, Sn-Cu-Ni solder, especially Sn-Zn solder melting point is very close to tin-lead solder, but due to Sn -Zn series solder has poor wettability, so it is still difficult to apply to industrial production, and still needs research and improvement
[0003] In recent years, "Sn-Zn-Ga-Ce lead-free solder" (Chinese invention patent, CN101269446) and "a tin-zinc-based lead-free solder alloy" (Chinese invention patent) have been developed on the basis of Sn-Zn at home and abroad in recent years. , CN101585120), "A Sn-Zn lead-free solder alloy and its preparation method" (Chinese invention patent, CN101058131) and "Sn-Zn-based lead-free solder alloy containing rare earth elements" (Chinese invention patent, CN1390672) Sn-Zn solders of various "multi-alloy systems" have improved some properties compared with binary Sn-Zn alloys, but they are still not as good as traditional Sn-Pb solders in terms of overall performance, so , Sn-Zn solder still needs further improvement

Method used

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  • Sn-Zn lead-free solder containing Nd, Ga and Se

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A kind of Sn-Zn lead-free solder containing Nd, Ga, Se, proportioned according to mass percentage, its composition is: 6.0% Zn, 0.5% Nd, 0.005% Ga, 0.001% Se, remaining The amount is Sn.

[0022] The solidus temperature of the "Nd, Ga, Se-containing Sn-Zn lead-free solder" obtained from the above composition ratio is about 198°C, and the liquidus temperature is about 206°C (both taking into account experimental errors). Cooperating with commercially available RMA brazing flux, it has excellent wetting performance on the copper plate, and the tensile strength of the brazing seam reaches 75MPa±15MPa.

Embodiment 2

[0024] A kind of Sn-Zn lead-free solder containing Nd, Ga, Se, proportioning by mass percentage, its composition is: 10.5% Zn, 0.005% Nd, 1.5% Ga, 0.3% Se, the balance is Sn.

[0025] The solidus temperature of the "Nd, Ga, Se-containing Sn-Zn lead-free solder" obtained by the above-mentioned composition ratio is about 198°C, and the liquidus temperature is about 207°C (both taking into account experimental errors). Cooperating with commercially available RMA brazing flux, it has excellent wetting performance on the copper plate, and the tensile strength of the brazing seam reaches 75MPa±15MPa.

Embodiment 3

[0027] A kind of Sn-Zn lead-free solder containing Nd, Ga, Se, proportioning by mass percentage, its composition is: the Zn of 8.5%, the Nd of 0.25%, the Ga of 1.0%, the Se of 0.2%, the surplus is Sn.

[0028] The solidus temperature of the "Nd, Ga, Se-containing Sn-Zn lead-free solder" obtained from the above composition ratio is about 198°C, and the liquidus temperature is about 204°C (both taking into account experimental errors). Cooperating with commercially available RMA brazing flux, it has excellent wetting performance on the copper plate, and the tensile strength of the brazing seam reaches 75MPa±15MPa.

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Abstract

The invention discloses a Sn-Zn lead-free solder containing Nd, Ga and Se, and belongs to metal materials and solder materials in the metallurgical field. The Sn-Zn lead-free solder containing Nd, Ga and Se comprises the following chemical components in percentage by weight: 6.0-10.5% of Zn, 0.005-0.5% of Nd, 0.005-1.5% of Ga, 0.001-0.3% of Se and the balance of Sn. Because the solder has excellent 'oxidation resistant property', the Sn-Zn lead-free solder containing Nd, Ga and Se has favorable wetting performance and excellent welding spot (soldering seam) performance, and is suitable for welding methods of wave peak welding, immersion welding, manual welding, reflow soldering and the like of the electronic industry.

Description

technical field [0001] The invention relates to a Sn-Zn lead-free solder containing Nd, Ga and Se, belonging to metal materials and brazing materials in the field of metallurgy. It is mainly used for the assembly and packaging of components in the electronic industry. It is a new type of green and environmentally friendly lead-free solder with good brazing performance (such as wetting performance) and excellent mechanical properties of solder joints (brazing seams). Background technique [0002] With the entry into force of the RoHS (The Restriction of the Use of certain Hazardous Substance in Electrical and Electronic Equipment) directive, the replacement of tin-lead solder has always been a hot research topic for technicians in the electronics industry. At present, representative lead-free solders include Sn-Ag-Cu, Sn-Cu, Sn-Cu-Ni and other alloy systems, each of which has its own strengths, but compared with tin-lead solders, the cost of solder, solder There is still a c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
Inventor 薛鹏薛松柏沈以赴龙伟民于新泉
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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