Sn-Zn lead-free solder containing Nd, Ga and Se
A lead-free solder, sn-zn technology, used in welding/cutting media/materials, welding media, metal processing equipment, etc., can solve the cost of solder, the melting point gap of solder, difficult to industrialize production, poor wetting performance And other issues
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0021] A kind of Sn-Zn lead-free solder containing Nd, Ga, Se, proportioned according to mass percentage, its composition is: 6.0% Zn, 0.5% Nd, 0.005% Ga, 0.001% Se, remaining The amount is Sn.
[0022] The solidus temperature of the "Nd, Ga, Se-containing Sn-Zn lead-free solder" obtained from the above composition ratio is about 198°C, and the liquidus temperature is about 206°C (both taking into account experimental errors). Cooperating with commercially available RMA brazing flux, it has excellent wetting performance on the copper plate, and the tensile strength of the brazing seam reaches 75MPa±15MPa.
Embodiment 2
[0024] A kind of Sn-Zn lead-free solder containing Nd, Ga, Se, proportioning by mass percentage, its composition is: 10.5% Zn, 0.005% Nd, 1.5% Ga, 0.3% Se, the balance is Sn.
[0025] The solidus temperature of the "Nd, Ga, Se-containing Sn-Zn lead-free solder" obtained by the above-mentioned composition ratio is about 198°C, and the liquidus temperature is about 207°C (both taking into account experimental errors). Cooperating with commercially available RMA brazing flux, it has excellent wetting performance on the copper plate, and the tensile strength of the brazing seam reaches 75MPa±15MPa.
Embodiment 3
[0027] A kind of Sn-Zn lead-free solder containing Nd, Ga, Se, proportioning by mass percentage, its composition is: 8.5% Zn, 0.25% Nd, 1.0% Ga, 0.2% Se, the balance is Sn.
[0028] The solidus temperature of the "Nd, Ga, Se-containing Sn-Zn lead-free solder" obtained from the above composition ratio is about 198°C, and the liquidus temperature is about 204°C (both taking into account experimental errors). Cooperating with commercially available RMA brazing flux, it has excellent wetting performance on the copper plate, and the tensile strength of the brazing seam reaches 75MPa±15MPa.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com