A gallium nitride-based light-emitting diode epitaxial wafer structure and its preparation method
A light-emitting diode, gallium nitride-based technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of reduced radiation recombination efficiency, reduced LED internal quantum efficiency, etc., and achieve the effect of increasing the light-emitting area
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[0026] The specific implementation of the structure of a GaN-based light-emitting diode epitaxial wafer on a weakly polar surface and its preparation method provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0027] attached figure 2 And attached image 3 Shown is a schematic diagram of the process of the method of the present invention. The specific steps of the method for preparing the epitaxial wafer structure of a gallium nitride-based light-emitting diode on a weakly polar surface according to the present invention are as follows:
[0028] 1) Load the graphic substrate 11 into the reaction chamber, and 2 Heating to above 1050°C in the atmosphere for heat treatment of the substrate for 10-20 minutes; then cooling down at 500-650°C to grow a nucleation layer with a thickness of 15-100nm, the material is Al x In y Ga 1-x-y N, where 0≤X≤1, 0≤Y≤1.
[0029] 2) High-temperature annealing at 900-1100°C to obtain...
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