Six-transistor static random access memory unit and manufacturing method thereof
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A memory cell, static random technology, used in static memory, semiconductor/solid-state device manufacturing, transistors, etc., can solve the problems of shortened device life, low degree of asymmetry, and increased degree of asymmetry of devices, so as to reduce cost and process. simple effect
Active Publication Date: 2015-04-08
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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[0005] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a six-transistor SRAM unit and a manufacturing method thereof, which are used to solve the problem of reading and writing caused by the low asymmetry of the six-transistor SRAM unit in the prior art. Instability, or the problem of shortening the life of the device in order to increase the degree of asymmetry of the device
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Embodiment 1
[0055] Such as Figure 1~Figure 3 As shown, the present invention provides a six-transistor SRAM unit, the memory unit at least includes:
[0056] The first inverter 10 is composed of a first PMOS transistor 101 and a first NMOS transistor 102;
[0057] The second inverter 11 is composed of a second PMOS transistor 111 and a second NMOS transistor 112;
[0058] The transmission gate is composed of a third NMOS transistor 12 and a fourth NMOS transistor 13;
[0059] Wherein, the source of the third NMOS transistor 12 is connected to the output terminal of the first inverter 10 and the input terminal of the second inverter 11 at the same time, the gate is connected to the word line of the memory, and the drain is connected to the memory the bit line;
[0060] The source of the fourth NMOS transistor 13 is connected to the input terminal of the first inverter 10 and the output terminal of the second inverter 11 at the same time, the gate is connected to the word line of the me...
Embodiment 2
[0068] see Figure 2~3 and Figure 4~7 This embodiment provides a method for manufacturing a six-transistor SRAM unit, and the method at least includes the following steps:
[0069] Such as Figure 4 As shown, step 1) is first performed, providing a semiconductor substrate, and defining active regions 20a, 20b, 20c and 20d in the semiconductor substrate, and forming shallow trench isolation trenches around the active region ( not shown); specifically, the active regions 20a, 20b, 20c and 20d are defined first, then shallow trenches are etched around the active regions, and finally insulating materials are filled in the shallow trenches to form the Shallow trench isolation trenches. In this embodiment, the semiconductor substrate is a bulk silicon substrate or a silicon-on-insulator substrate, and the insulating material is silicon dioxide.
[0070] Such as Figure 5 shown, and then proceed to step 2) to form an N-type well implantation region 22 in the semiconductor subst...
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Abstract
The present invention relates to the technical field of memory design and manufacturing. Provided are a six-transistor static random access memory unit and manufacturing method thereof, the memory unit comprising two phase-inverters and a transmission gate; each phase-inverter consists of a structurally symmetric NMOS transistor and a structurally symmetric PMOS transistor connected to each other; the transmission gate consists of two NMOS transistors having asymmetric source and drain structures; the source structure of the NMOS transistor having asymmetric source and drain structures is provided with a pocket region and a lightly doped drain (LDD) region, and the drain structure is not provided with a pocket region or an LDD region. The present invention employs a transmission gate N-type transistor having an asymmetric structure, and eliminates the asymmetry caused by the LDD region and the pocket region of the drain without changing device processing technique, additionally increasing the layout size, or reducing the service life of a device, thus achieving electrical asymmetry obviously superior to the existing structures. The present invention has a simple process and reduced cost, and is suitable for industrial production.
Description
technical field [0001] The invention belongs to the technical field of memory design and manufacture, and in particular relates to a six-transistor static random access memory unit and a manufacturing method thereof. Background technique [0002] The memory is divided into flash memory (Flash), dynamic random access memory (DRAM) and static random access memory (SRAM). Among them, static random access memory has become the first choice for key system storage modules because of its fast read and write and no need for periodic refresh, such as CPU and Cache between main memory, etc. Although the static memory occupies a larger area than other memories at the same storage capacity, it still cannot be replaced by other new types of memories in the case of fast read and write. [0003] Currently commonly used SRAM cells mainly use six transistors, which are composed of two pull-up P-type transistors, two pull-down N-type transistors and two transfer-gate N-type transistors. The...
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