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Preparation and application methods of thermoplastic adhesive for powder microinjection molding

A thermoplastic binder and micro-injection technology, which is applied in the field of preparation and removal of thermoplastic binders for metal and ceramic powder micro-injection molding, can solve the problems of incomplete filling and insufficient fluidity of feeding materials, and achieve size The effects of high shape accuracy, expanded production application range, and improved forming accuracy

Inactive Publication Date: 2012-11-14
UNIV OF SCI & TECH BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the above problems, the object of the present invention is to provide a thermoplastic bonding agent for metal and ceramic powder micro-injection molding that overcomes the defects of insufficient feeding fluidity and incomplete filling caused by the binder commonly used in traditional injection molding technology. Preparation and method of use

Method used

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  • Preparation and application methods of thermoplastic adhesive for powder microinjection molding
  • Preparation and application methods of thermoplastic adhesive for powder microinjection molding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The composition of the binder is: 36%PW + 9%BW + 25%HDPE + 20%EVA + 10%SA, where each component is a mass percentage. The process is: in a constant temperature device, at a temperature of 110 oC, high-density polyethylene is first added and melted, and then ethylene-vinyl acetate, paraffin wax, beeswax, and stearic acid are added in sequence. After all the components are melted, continue heating and stirring for 10 minutes, and mix thoroughly to obtain a premixed binder. The volume ratio of binder to metal powder is 54:46 ratio , Add the solid powder in 3 times on average until all are mixed evenly. The mixing time of powder and binder is 1.5 hours. The injection temperature of the feed is 145-160oC, and the injection pressure is 60-80MPa. After the injection, solvent degreasing + thermal degreasing is used to remove the binder. Among them, the process of solvent degreasing is soaked for 6 hours, and the solvent is carbon tetrachloride.

[0019]

Embodiment 2

[0021] The composition of the binder is: 30%PW + 12%BW + 32%HDPE + 18%EVA + 8%SA, where each component is a mass percentage. The process is: in a constant temperature device, at a temperature of 130 oC, high-density polyethylene is first added and melted, and then ethylene-vinyl acetate, paraffin wax, beeswax, and stearic acid are added in sequence. After all the components are melted, continue heating and stirring for 10 minutes, and mix thoroughly to obtain a premixed binder. The volume ratio of the binder and the metal powder is 46:54, and the metal or ceramic powder is added in 3 times on average until all are mixed evenly. The mixing time of metal powder and binder is 2 hours. The injection temperature of the feed is 150-165oC, and the injection pressure is 70-90MPa. After the injection is completed, solvent degreasing + thermal degreasing is used to remove the binder. Among them, the process of solvent degreasing is soaked for 12 hours, and the solvent is n-heptane.

...

Embodiment 3

[0024] The composition of the binder is: 20%PW + 15%BW + 20%HDPE + 30%EVA + 15%SA, where each component is a mass percentage. The process is as follows: in a constant temperature device, at a temperature of 150 oC, high-density polyethylene is first added and melted, and then ethylene-vinyl acetate, paraffin wax, beeswax, and stearic acid are added in sequence. After all the components are melted, continue heating and stirring for 10 minutes, and mix thoroughly to obtain a premixed binder. The volume ratio of binder and ceramic powder is 50:50 ratio, Add the ceramic powder in 3 times on average until all are mixed evenly. The mixing time of ceramic powder and binder is 2 hours. The injection temperature of the feed is 145-165oC, and the injection pressure is 60-90MPa. After the injection is complete, the binder is removed by thermal degreasing.

[0025]

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Abstract

The invention discloses preparation and application methods of a thermoplastic adhesive for powder microinjection molding, and belongs to the technical field of powder microinjection. The preparation and application methods are characterized in that the adhesive is composed of a plurality of components, a mixing process with metal and ceramic powder is simple, an injection temperature window is wide, flowability of feedstock is good, green body strength during demoulding and degreasing, no injection and degreasing defects exist, and a residual quantity after degreasing is small. The adhesive contains, by mass, 5-40% of paraffin wax (PW), 5-20% of beewax (BW), 10-32% of high density polyethylene (HDPE), 10-40% of ethylene-vinyl acetate (EVA) and 5-25% of stearic acid (SA). According to the methods, the forming precision of minisize parts produced through the powder microinjection molding technology is improved remarkably, and production and application ranges of metal and ceramic minisize parts are broadened.

Description

technical field [0001] The invention belongs to the technical field of powder micro-injection molding, and in particular provides a method for preparing and removing a thermoplastic binder for metal and ceramic powder micro-injection molding. Background technique [0002] With the continuous development of microsystem technology in recent years and people's increasing demand for miniaturization and miniaturization of products, the application potential of microsystem technology is huge, and its application in the fields of electronics, information, and communication technology has been continuously expanding. , its demand and development potential will be immeasurable in the future. Microstructures and components are the basis for the realization and development of microsystem technology, and the processing and production of microstructures and components has become one of the key factors determining the development of this technology. [0003] The preparation methods of mi...

Claims

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Application Information

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IPC IPC(8): C08L23/08C08L91/06C08L23/06C08K5/09B22F3/22C04B35/632C04B35/634
Inventor 尹海清曲选辉倪新雷
Owner UNIV OF SCI & TECH BEIJING
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