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Selective metallization method of surface of ceramic, and ceramic and its application

A ceramic surface and selective technology, applied in the field of ceramics, can solve the problems of high cost of metallization on the ceramic surface, low adhesion between the chemical plating layer and the substrate, etc., and achieve the effect of high adhesion

Active Publication Date: 2012-11-14
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention solves the technical problems of low adhesion between the electroless plating layer on the ceramic surface and the base material and high metallization cost on the ceramic surface existing in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038](1) Ceramic composition:

[0039] Ceramic powder: high-purity Al with particle size less than 3um 2 o 3 Powder 9.45 grams, glass powder 0.5 grams (MgO\Al 2 o 3 \B 2 o 3 \CaO-based glass powder); functional powder: CeO 2 0.05 grams.

[0040] (2) Fully mix the ceramic composition evenly, then add 1 gram of PVA solution with a concentration of 6wt%, grind and granulate; then use a manual molding machine to press the granulated powder into a green body with a diameter of 15mm, and the pressure is 10MPa. Put the green body into a closed box furnace for debinding and sintering, the heating rate is 5°C / min, the debinding temperature is 575°C, and the sintering temperature is 1600°C. The ceramic substrate is obtained by cooling with the furnace.

[0041] (3) Place the ceramic substrate on a YAG laser with a wavelength of 1064nm for laser radiation, with a power of 50W, a frequency of 25KHz, a line speed of 100mm / s, and a filling pitch of 0.1mm.

[0042] (4) Put the las...

Embodiment 2

[0044] Using the same steps as in Example 1 to prepare the ceramic substrate, and metallize the ceramic surface, the obtained sample is denoted as S2, the difference is that in step (1), the functional powder is Nd 2 o 3 0.05 grams.

Embodiment 3

[0046] The same steps as in Example 1 were used to prepare the ceramic substrate, and the ceramic surface was metallized, and the obtained sample was denoted as S3, the difference being that in step (1), the functional powder was Sm 2 o 3 0.05 grams.

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PUM

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Abstract

The invention provides a selective metallization method of the surface of a ceramic. The method comprises the following steps: 1, molding and sintering a ceramic composition to obtain a ceramic substrate, wherein the ceramic composition comprises ceramic powder and functional powder dispersed in the ceramic powder, the functional powder comprises one or more selected from an oxide, a nitride, an oxynitride and a carbide of M, and an M elementary substance, and the ceramic powder comprises one or more selected from an oxide, a nitride, an oxynitride and a carbide of E; 2, irradiating a selected area of the surface of the ceramic substrate by energy beams to form a chemical plating activity center in the selected area; and 3, chemically plating the surface of the ceramic substrate subjected to step 2 to form a metal coating in the selected area. The invention also provides the ceramic. The metal coating is formed on the surface of the ceramic through the chemical plating in the invention, so the coating has a high adhesion with the ceramic substrate, and has a low cost.

Description

technical field [0001] The invention belongs to the field of ceramics, in particular to a ceramic surface selective metallization method and a ceramic. Background technique [0002] Forming a three-dimensional circuit on the ceramic surface can form a three-dimensional circuit carrier integrating electromechanical functions. At the same time, ceramic devices with three-dimensional circuits on the surface have high thermal conductivity and mechanical strength, long service life, strong aging resistance, etc., so they will be widely used in the electronic field. At present, the process of forming a three-dimensional circuit on the ceramic surface is: surface degreasing-mechanical roughening-chemical roughening-sensitization activation-electroless plating, the process is cumbersome, and the obtained metal coating, that is, the adhesion between the circuit and the ceramic substrate is low . [0003] For example, CN101550546A discloses a preparation method of electroless platin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B41/88
Inventor 宫清林信平任永鹏张保祥
Owner BYD CO LTD
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