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Large-area welding method

A welding method and large-area technology, applied in the field of microelectronics, can solve problems such as welding failure, and achieve the effect of improving welding quality

Active Publication Date: 2012-11-07
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a large-area welding method to solve the problem of welding failure during large-area welding in the prior art

Method used

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Embodiment Construction

[0018] In order to solve the surface error problem of the welding surface in the prior art, the present invention provides a large-area welding method. The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0019] figure 1 It is a flow chart of the large-area welding method of the present invention. The embodiment of the present invention relates to a large-area welding method, specifically:

[0020] Firstly, welding films are respectively made on the welding surfaces of the two welding pieces to be welded. The welding film is a metal material layer covering the welding surface. The present invention uses two metals with different melting points to make the welding film, wherein the welding film with a high melting point has a microstructure with an indep...

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Abstract

The invention discloses a large-area welding method. The method comprises the following steps of: manufacturing a first welding film on the welding surface of a first welding part; manufacturing a second welding film on the welding surface of a second welding part, wherein the manufactured first welding film has a cylindrical microstructure, the melting point t of the material of the first welding film is higher than the melting point t1 of the material of the second welding film, and the materials of the first welding film and the second welding film form metallographic structures; and heating the second welding part to temperature t2 which is greater than t2 under the condition that the two welding films contact each other to ensure that loose structures of liquid-phase second welding film and solid-phase first welding film are infiltrated, and then cooling to finish welding. By the method, the problem that welding is failed because bubbles which are remained on a combination surface easily due to the welding surface types can be solved effectively.

Description

technical field [0001] The invention relates to the field of microelectronics, in particular to a large-area welding method. Background technique [0002] In the design of solid-state lasers, in order to improve the output of the laser, the first problem to be solved is to improve the heat dissipation capacity of the laser working substance. The better choice is to increase the heat dissipation area of ​​the working substance. Therefore, with the development of laser technology, the laser working substance is more Most of them are designed as slats, sheets or optical fibers. In slab and sheet lasers, although the heat dissipation area of ​​the working substance has been increased, how to take away the heat of the working substance as soon as possible has become a new problem. The heat dissipation structure currently used is directly cooled by water or through a welding heat sink. Contact cooling, etc. In comparison, solder-cooled heat sinks are a better choice for slab and...

Claims

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Application Information

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IPC IPC(8): B23K1/00C23C14/14C23C14/24
Inventor 陈三斌周寿桓唐晓军
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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