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Electromagnetic wave shielding material for FPC

A technology of shielding materials and electromagnetic waves, which is applied in the field of electromagnetic wave shielding materials for FPC, can solve the problems of disappearance and the decline of electromagnetic wave shielding machines, and achieve the effect of suppressing thickness

Inactive Publication Date: 2012-10-31
FUJIMORI KOGYO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, there is concern that the electromagnetic wave shielding function of the electromagnetic wave shielding material for FPC will decrease or disappear.

Method used

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  • Electromagnetic wave shielding material for FPC
  • Electromagnetic wave shielding material for FPC
  • Electromagnetic wave shielding material for FPC

Examples

Experimental program
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Effect test

Embodiment 1

[0107] A polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., product number: E5100) having a thickness of 50 μm was used as the support film 6 . On one side of the support film 6, a solvent-soluble polyimide coating liquid was cast-coated so that the thickness after drying became 4 μm, and dried to laminate a dielectric thin resin film. Substrate 1. On the formed base material 1, the paint for forming the adhesive bond layer 2 is applied so that the thickness after drying is 0.3 μm, and the adhesive bond layer 2 is laminated. Carbon black, which is a black pigment, is mixed with a polyester resin composition having a heat-resistant temperature of 260 to 280°C. On the adhesive layer 2, as a conductive filler, a conductive paste prepared by mixing silver particles with a primary average particle diameter of about 50 nm is used, and after drying, the thickness becomes 0.3 μm. It baked at 150 degreeC, the electroconductive paste layer 3 was formed, and the e...

Embodiment 2

[0109]A polyethylene terephthalate (PET) film (manufactured by Toyobo Co., Ltd., product number: E5100) having a thickness of 50 μm was used as the support film 6 . On one side of the support film 6, a solvent-soluble polyimide coating liquid was cast-coated so that the thickness after drying became 8 μm, dried, and a thin resin film made of a dielectric was laminated. Substrate 1. On the formed base material 1, the paint for forming the adhesive bond layer 2 is applied so that the thickness after drying is 0.3 μm, and the adhesive bond layer 2 is laminated. Carbon black, which is a black pigment, is mixed with a polyester resin composition having a heat-resistant temperature of 260 to 280°C. On the adhesive layer 2, as a conductive filler, a conductive paste prepared by mixing silver particles with a primary average particle diameter of about 50 nm is used, and after drying, the thickness becomes 0.3 μm. It baked at 150 degreeC, the electroconductive paste layer 3 was forme...

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Abstract

The invention provides an electromagnetic wave shielding material for FPC. The electromagnetic wave shielding material is flexible and thin. Even the electromagnetic wave shielding material is bent repeatedly and severely, the electromagnetic wave shielding performance does not degrade and thus the bending property is excellent. The electromagnetic wave shielding material (5) for FPC is characterized in that a base material (1) formed by coated dielectric thin resin film, a filmy adhesive layer (2), and an electrical conductivity layer (3) are laminated on a single face of a support body film (6), wherein the base material (1) is made of polyimide film formed by polyimide which is soluble through a solvent and is 1-9 microns thick.

Description

technical field [0001] The present invention relates to an electromagnetic wave shielding material for FPC, which covers a flexible printed circuit board (hereinafter referred to as FPC) subjected to repeated bending operations, and is used for shielding electromagnetic waves. Background technique [0002] In portable electronic devices such as mobile phones, electronic components are integrated on printed circuit boards in order to reduce the size of the housing and control the size of the housing so that it can be carried easily. In addition, in order to reduce the external dimensions of the box, by dividing the printed circuit board into multiple parts, and using a flexible FPC for the connection wiring between the divided printed circuit boards, the printed circuit board can be folded, or the printed circuit board can be folded. It slides. [0003] In addition, in recent years, important electronic components and FPCs are covered with electromagnetic wave shielding mate...

Claims

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Application Information

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IPC IPC(8): H05K9/00B32B15/02B32B15/08B32B7/12
CPCB32B7/12B32B27/08B32B27/18B32B27/281B32B2307/212C09J11/00H05K9/0086
Inventor 后藤信弘藤井早苗稻叶佑子小国盛稔
Owner FUJIMORI KOGYO CO LTD
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