Low-temperature low expansion coefficient high-rigidity lead-free electronic glass powder and preparation method thereof

A technology of low expansion coefficient and glass powder, which is applied in the field of low temperature, low expansion coefficient, high hardness lead-free electronic glass powder and its preparation. Problems, to achieve the effect of excellent electrical properties, small thermal expansion coefficient, and small melting point

Active Publication Date: 2012-10-31
西安宏星电子浆料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main problem is that the lead content is high, and the dosage is 50% to 80%. In the production process of glass, it will cause great harm to the health of operators and the environment; into rainwater and soil, causing greater harm to the environment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0053] The material properties prepared according to the preparation method of the present invention are as follows:

[0054] color: gray;

[0055] Softening temperature: Tg=370℃;

[0056] Sealing temperature: 430℃~460℃;

[0057] Water resistance: (0.1010~0.1027) mg / cm 2 ;

[0058] Bulk density: (6.204~6.241)g / cm 3 ;

[0059] Dielectric constant: (5.72~8.68);

[0060] Dielectric loss: (6.2~8.2)×10 -4 ;

[0061] Volume resistivity: room temperature (1.02~2.03)×10 14 Ω·cm,

[0062] Breakdown strength: ≥22.36kv / mm;

[0063] Flexural strength: (130.32~155.65) MPa;

[0064] Coefficient of thermal expansion, (5.56~6.09)×10 -7 ℃ -1 .

Embodiment 1

[0066] 1. Formula

[0067] Bi 2 o 3 60 parts; ZnO 10 parts;

[0068] B 2 o 3 10 parts; CaF 2 3 copies;

[0069] MoO 3 5 copies; Al 2 o 3 1.5 servings.

[0070] SiO 2 3 copies; P 2 o 5 1.5 copies;

[0071] Sb 2 o 3 4 copies; WO 3 2 servings.

[0072] Carry out accurate weighing according to above-mentioned material proportioning, total weight is 1Kg.

[0073] 2. Mixing in the V-shaped mixer for 20 minutes;

[0074] 3. Melting Put the crucible in the crucible furnace, compile the program, raise the temperature to 1100°C, add the material, add the material for the second time after 20 minutes, until the crucible is full, take it out after another 20 minutes of melting, and slowly pour it into a container filled with water inside.

[0075] 4. Drying After the material is smelted, pour off the water, drain the water, put the material into a clean enamel tray, and dry it at 120 ° C ~ 150 ° C for 8 ~ 15 hours;

[0076] 5. Ba...

Embodiment 2

[0079] 1. Formula

[0080] Bi 2 o 3 65 parts; ZnO 8 parts;

[0081] B 2 o 3 10 parts; CaF 2 2 copies;

[0082] MoO 3 2 copies; Al 2 o 3 2 servings.

[0083] SiO 2 5 copies; P 2 o 5 2 copies;

[0084] Sb 2 o 3 2 copies; WO 3 2 servings.

[0085] Carry out accurate weighing according to above-mentioned material proportioning, total weight is 1Kg.

[0086] 2. Mixing in the V-shaped mixer for 20 minutes;

[0087] 3. Melting Put the crucible in the crucible furnace, compile the program, raise the temperature to 1100°C, add the material, add the material for the second time after 20 minutes, until the crucible is full, take it out after another 20 minutes of melting, and slowly pour it into a container filled with water inside.

[0088] 4. Drying After the material is smelted, pour off the water, drain the water, put the material into a clean enamel tray, and dry it at 120 ° C ~ 150 ° C for 8 ~ 15 hours;

[0089] 5. Ball mi...

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PUM

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Abstract

The invention relates to a low-temperature low expansion coefficient high-rigidity lead-free electronic glass powder and a preparation method thereof. The electronic glass powder comprises, by weight, 30-80 parts of Bi2O3, 10-30 parts of ZnO, 10-30 parts of B2O3, 3-5 parts of CaF2, 2-8 parts of MoO3, 1-5 parts of Al2O3, 0-10 parts of SiO2, 0-5 parts of P2O5, 0-5 parts of Sb2O3 and 0-5 parts of WO3. According to the low-temperature low expansion coefficient high-rigidity lead-free electronic glass powder and the preparation method thereof, lead-free environment-friendly materials are used, and during production, the materials have no harm on human bodies and don't generate harmful waste gases, waste water and waste residues, so that the materials are new materials which are environment-friendly in raw materials, production processes and products; the glass powder is good in electrical performance, low in melting point, small in coefficient of thermal expansion, high in rigidity and low in leakage current; temperatures of sealing-in are low, and the sealing-in can be achieved at temperatures of 450 DEG C + / - 10 DEG C; and the expansion coefficient of the materials is 5.85ppm, and the materials are matched with lightning arrester valve block matrixes.

Description

Technical field [0001] The invention is the field of electronic materials technology, involving a low -temperature and low -expansion coefficient high -hardness lead -free electronic glass powder and its preparation methods. Background technique [0002] In known technologies, the electronic glass that is widely used in electronic components, electrical vacuum devices, semiconductor devices is packed and sealed, and currently uses PBO-B 2 O 3 -Sio 2 , PBO-ZNO-B 2 O 3 The material system, the material system has good sealing performance, good electrical properties, and moderate price. It is the mainstream of the current sealing glass.The main problem of existence is that the lead content is high, and the amount is 50%to 80%. During the production of glass, it will cause great harm to the operator's health and environment.In rainy and soil, it will cause greater harm to the environment.In order to reduce the harm to the human body and the environment, a lead -free sealing glass mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C12/00C03C8/24
Inventor 李宏杰张志旭卫海民蒋文军
Owner 西安宏星电子浆料科技股份有限公司
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