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LED (Light Emitting Diode) lamp module and manufacturing method thereof

A technology of LED lamps and modules, applied in lighting devices, cooling/heating devices of lighting devices, light sources, etc., can solve the problems of cumbersome production process, long heat transfer distance, low heat transfer rate, etc.

Inactive Publication Date: 2012-10-17
王定锋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The combination of traditional cooling support lamp carrier and circuit board is to make an aluminum-based circuit board, copper-based circuit board, or ceramic-based circuit board first, and then solder the components through SMT, and then attach the back of the circuit board to the three-dimensional heat dissipation Supporting the lamp carrier, this method has a long heat transfer distance and layers of thermal resistance, resulting in low heat conduction rate, slow heat conduction, and the production process is quite cumbersome, the production time is long, and it also causes serious pollution to the environment

Method used

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  • LED (Light Emitting Diode) lamp module and manufacturing method thereof
  • LED (Light Emitting Diode) lamp module and manufacturing method thereof
  • LED (Light Emitting Diode) lamp module and manufacturing method thereof

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Embodiment Construction

[0031] The following will describe in more detail the specific embodiments of the LED lamp module of the present invention, which is made by directly bonding LEDs with conductive adhesive lines and the three-dimensional heat dissipation support lamp carrier.

[0032] However, those skilled in the art can obviously understand that these implementation modes are only some preferred embodiments of the present invention, and do not limit the present invention and its protection scope in any way. Those of ordinary skill in the art can make some obvious changes and modifications on the condition of understanding the basic idea of ​​the present invention, and these all belong to the scope of the present invention. The scope of the invention is limited only by the claims.

[0033] According to a preferred embodiment of the present invention, a three-dimensional heat dissipation supporting lamp carrier of an LED lamp module is provided. figure 1 It is a schematic diagram of a metal th...

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Abstract

The invention relates to an LED (Light Emitting Diode) lamp module and a manufacturing method thereof. Specifically, the LED lamp module provided by the invention comprises a stereoscopic radiating support lamp carrier, a sticky conductive medium and an LED, wherein the sticky conductive medium is distributed on the stereoscopic radiating support lamp carrier to form a circuit of the LED lamp module; and the LED is fixedly stuck to the circuit formed by the sticky conductive medium, and conducts with the circuit. The sticky conductive medium plays a role of a conductive circuit, as well as roles in sticking the LED and other electronic devices. The invention further provides an LED lamp module manufacturing method. According to the LED lamp module, etching is not needed to manufacture the circuit board, the whole manufacturing process flow is shortened as the LED and other devices are also not welded by SMT (Surface Mounting Technology), the materials are saved, the manufacturing time is shortened and the production efficiency is greatly improved, the environment pollution caused by etching in traditional circuit board manufacturing process is reduced, the production cost is greatly reduced, and the environment is protected.

Description

technical field [0001] The invention belongs to the field of LED applications, and in particular relates to a novel LED lamp module and a manufacturing method thereof. Background technique [0002] The combination of traditional cooling support lamp carrier and circuit board is to make an aluminum-based circuit board, copper-based circuit board, or ceramic-based circuit board first, and then solder the components through SMT, and then attach the back of the circuit board to the three-dimensional heat dissipation Supporting the lamp carrier, this method has a long heat transfer distance and layers of thermal resistance, resulting in low heat conduction rate, slow heat conduction, and the production process is quite cumbersome and takes a long time, and it also causes serious pollution to the environment. [0003] How to reduce thermal resistance so that the heat generated by LED can be dissipated as soon as possible has always been a problem in the LED industry. With the appl...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V29/00F21V23/06F21V19/00F21Y101/02F21V29/50
Inventor 王定锋徐文红
Owner 王定锋
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