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Photosensitive resin and preparation method and application thereof

A technology of photosensitive resin and photoresist, which is applied in the direction of photomechanical equipment, photosensitive materials for photomechanical equipment, optics, etc., to achieve the effects of easy availability of raw materials, avoiding uneven lines, and good film-forming properties

Active Publication Date: 2014-03-05
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This leads to the edge of the exposed area and the unexposed area during development after exposure, and the small amount of phenolic resin in the unexposed area dissolves into the developer quickly, making the line width uneven, thereby reducing the resolution.

Method used

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  • Photosensitive resin and preparation method and application thereof
  • Photosensitive resin and preparation method and application thereof
  • Photosensitive resin and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Dissolve 10 g of polymethyl methacrylate and 3.24 g (0.06 mol) of sodium methoxide in toluene, heat the system to weak reflux, and then slowly add 7.2 g (0.06 mol) of acetophenone dropwise to make the y value 40, drop Addition time was 2.5 hours. After dripping, continue to reflux for 2 hours, cool down, pour the reaction solution into methanol carefully, a solid precipitates out, filter the precipitate and dry it to obtain the aryl-substituted 1,3-diketone product. Then the aryl-substituted 1,3-diketone product was dissolved in acetonitrile, 7.88 g (0.04 mol) of p-toluenesulfonyl azide was added thereto, and after stirring at room temperature for 3.5 h, the reaction solution was poured into methanol , A solid precipitate was precipitated, and after filtering the precipitate, it was vacuum-dried at 30° C. for 24 hours to obtain a powdery photosensitive resin.

[0029] Infrared characterization results of powdered photosensitive resin: IR (KBr): 2143cm -1 (s, C=N=N), 1...

Embodiment 2

[0033] 10g of polymethyl methacrylate and 4.08g (0.06mol) of sodium ethylate were dissolved in methylene chloride, the system was heated to weak reflux, and then 8.04g (0.06mol) of p-methylacetophenone was slowly added dropwise, so that y The value was 40, and the dropping time was 3 hours. After dropping, continue to reflux for 4 hours, cool down, pour the reaction solution into ethanol carefully, a solid precipitates out, filter the precipitate and dry it to obtain the aryl-substituted 1,3-diketone product. Then the aryl-substituted 1,3-diketone product was dissolved in acetonitrile, 7.88 g (0.04 mol) of p-toluenesulfonyl azide was added thereto, and after stirring at room temperature for 5 h, the reaction solution was poured into ethanol, A solid precipitated out. After filtering the precipitate, it was vacuum-dried at 30° C. for 24 hours to obtain a powdery photosensitive resin.

[0034] Infrared characterization results of powdered photosensitive resin: IR (KBr): 2143cm ...

Embodiment 3

[0038] Dissolve 10 g of polymethyl methacrylate and 3.24 g (0.06 mol) of sodium methoxide in tetrahydrofuran, heat the system to weak reflux, and then slowly add an appropriate amount of 9.0 g (0.06 mol) of p-methoxyacetophenone, so that y The value is 40, so that the y value is 40, and the dropping time is 1.5 hours. After dripping, continue to reflux for 2 hours, cool down, pour the reaction solution into methanol carefully, a solid precipitates out, filter the precipitate and dry it to obtain the aryl-substituted 1,3-diketone product. Then the aryl-substituted 1,3-diketone product was dissolved in acetonitrile, 7.88 g (0.04 mol) of p-toluenesulfonyl azide was added thereto, and after stirring at room temperature for 3.5 h, the reaction solution was poured into methanol , a solid precipitated out, and the precipitate was filtered and vacuum-dried at 30° C. for 24 hours to obtain a powdery photosensitive resin.

[0039] Infrared characterization results of powdered photosens...

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Abstract

Provided are a photosensitive resin, process for preparing same and use thereof. The photosensitive resin comprises the compound represented by formula (I), wherein R is represented by formula (II) or (III); and R2 and R3 are independently H, halogen, C1-C4 alkyl, N,N-dimethylamino, N,N-diethylamino, cyclohexyl, methoxyl or ethoxy; x+y=100, x is an integer of 0-99, and y is an integer of 0-100. The photosensitive resin has photosensitivity as well as good film-forming property.

Description

technical field [0001] The invention relates to a photosensitive resin and its preparation method and application, in particular to a photosensitive resin which can be used for a positive photoresist and a positive photoresist obtained by using the photosensitive resin. Background technique [0002] The currently commonly used positive photoresists are: small molecule photosensitive agent (esterification product of trihydroxybenzophenone and diazonaphthoquinone sulfonyl chloride), film-forming resin (mostly phenolic resin), solvent and some other additives. Phenolic resins are condensation products of small molecule phenols and aldehydes, which have a certain molecular weight distribution. This leads to the edge of the exposed area and the unexposed area during development after exposure, and the small amount of phenolic resin in the unexposed area dissolves into the developer quickly, making the line width uneven, thereby reducing the resolution. . Contents of the in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F120/14C08F8/30G03F7/039
CPCG03F7/039C08F120/14G03F7/0085C08F8/30G03F7/008G03F7/0125
Inventor 刘陆薛建设
Owner BOE TECH GRP CO LTD
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