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Acid polishing solution for surface machining of glass and silicon-contained compound

A silicon compound and surface processing technology, which is applied in the field of acid polishing liquid, can solve the problems of low polishing efficiency, achieve the effects of less dosage, uniform dispersion, and reduced surface scratches

Inactive Publication Date: 2012-08-29
JIANGSU SINO KRYSTALS OPTROINCS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the deficiency of low polishing efficiency of existing polishing fluids, the invention provides an acidic polishing fluid for surface processing of glass and silicon-containing compounds

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Weigh 250 grams of sodium epoxy succinate, add it to 5000 grams of water, and stir evenly. Then add 550 grams of Tianjiao Qingmei mixed rare earth polishing powder purchased on the market, stir well to form a polishing liquid, adjust the pH to 2.5, 3.5, 4.5 with sodium hydroxide, and then use it.

[0023] The prepared samples were polished on a Logitech CDP single-side polisher. Down pressure: 1psi, rotation speed of the lower plate and carrier plate is 50RPM, flow rate of polishing liquid: 100ml / min. The polishing rates of this series of polishing fluids are 1.22, 1.18, and 1.07 μm / min, respectively, without scratches on the glass surface, and without damage to the polishing machine.

Embodiment 2

[0025] Weigh 3, 35, and 350 grams of hydrolyzed polymaleic anhydride (molecular weight: 800), and 100 grams of poly(propylene oxide) alcohol ether respectively, add them to 5,000 grams of water, and stir evenly. Then add 550 grams of Tianjiao Qingmei mixed rare earth polishing powder purchased on the market, stir well to form a polishing liquid, adjust the pH to 3.5, and then use it.

[0026] The prepared samples were polished on a Logitech CDP single-side polisher. Down pressure: 1psi, rotation speed of the lower plate and carrier plate is 50RPM, flow rate of polishing liquid: 100ml / min. The polishing rates of this series of polishing fluids are 0.88, 1.03, 1.32 μm / min respectively, without scratches on the glass surface, and without damage to the polishing machine.

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PUM

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Abstract

The invention relates to the technical field of acid polishing solution based on rear-earth oxide for surface machining of glass and a silicon-contained compound, in particular to acid polishing solution for surface machining of the glass and the silicon-contained compound, which contains cerium-contained rear-earth oxide polishing powder and carboxylic polymer with molecular weight of 100 to 4000 and containing anhydride or amide groups, and the pH value of the acid polishing solution is 2.0 to 5.0. The acid polishing solution is uniform to disperse and has high production efficiency and stable product quality. Meanwhile, due to the adoption of the acid polishing solution, the surface scratch of an article to be polished can be greatly reduced, the abrasion of a polishing machine can be reduced, and the service life of the polishing machine can be prolonged. When the polishing solution is prepared, less polishing powder is used, easiness in cleaning is realized, and environmental pollution can be reduced.

Description

technical field [0001] The invention relates to the technical field of acid polishing liquid used for surface processing of glass and silicon-containing compounds based on rare earth oxides, in particular to an acid polishing liquid for surface processing of glass and silicon-containing compounds. Background technique [0002] At present, the polishing of glass and silicon-containing compounds mainly uses large-grained rare earth oxide powder as a polishing abrasive. The overall polishing rate is low, the dispersion stability is poor, and it is easy to cause serious surface scratches, and there are also defects such as low flattening and polishing efficiency. Long-time polishing often greatly reduces the polishing efficiency, resulting in rapid wear of the polishing machine, low production efficiency, and a large consumption of consumables. At the same time, the polishing powder used in the current polishing process has a high solid content, is difficult to clean, and has a ...

Claims

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Application Information

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IPC IPC(8): C09G1/02
Inventor 孙韬周涛
Owner JIANGSU SINO KRYSTALS OPTROINCS
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