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High precision composite polishing liquid, preparation method and use thereof

A compound polishing and high-precision technology, which is applied to the polishing composition containing abrasives, etc., can solve the problems of low flattening polishing efficiency, rapid wear of the polishing machine, and poor dispersion stability, so as to achieve stable polishing effect and improve flattening polishing Efficiency, easy-to-operate effect

Inactive Publication Date: 2007-02-28
孙韬
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the glass polishing liquid used in the production of glass processing enterprises mainly uses large particles of cerium oxide powder as polishing friction agent, the overall polishing rate is low, the dispersion stability is poor, it is easy to cause serious surface scratches, and there are also defects such as low flattening polishing efficiency
Long-time polishing often greatly reduces the polishing efficiency, resulting in rapid wear of the polishing machine, low production efficiency, and a large consumption of consumables

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0019] 1. Preparation of polishing solution:

[0020] Weigh 250 grams of cerium oxide, add it into 4417 grams of water, and stir evenly at room temperature to prepare a suspension of cerium oxide.

[0021] Add 333 grams of 30% silicon oxide or aluminum oxide with an average particle diameter of about 80 nanometers to the cerium oxide suspension, and stir evenly.

[0022] Add KOH, adjust the pH value to 5, 9, 10, 11 respectively, and make: samples A, B, C, D respectively.

[0023] Two, polishing example:

[0024]

[0025] Summary: Under the condition of the same raw material composition and different pH values, different polishing efficiencies can be obtained, up to 599nm / min.

example 2

[0027] 1. Preparation of polishing solution:

[0028] Weigh unequal amounts of cerium oxide, add the same amount of water respectively, stir evenly at room temperature, and prepare different cerium oxide suspensions respectively.

[0029] Add different amounts of 30% silicon oxide or aluminum oxide with an average particle diameter of about 80 nanometers to each cerium oxide suspension, and further stir evenly.

[0030] Then use KOH to adjust each pH value to 10 respectively to make polishing solutions A, B, C, D, and E.

[0031] Two, polishing examples:

[0032] Ceria(%)

[0033] Summary: Under the condition of the same pH value, different ratios of raw materials can obtain different polishing efficiencies, up to 663 nm / min.

example 3

[0035] 1. Preparation of polishing solution:

[0036] Weigh 250 grams of cerium oxide, add it into 4417 grams of water, and stir evenly at room temperature to prepare a suspension of cerium oxide.

[0037] Add 333 grams of 30% silicon oxide or aluminum oxide with an average particle diameter of 80 nanometers to the cerium oxide suspension, and further stir evenly.

[0038] Add KOH, adjust the pH value to 10 respectively, and make the primary product of polishing liquid.

[0039] Add different amounts of surfactants to the primary polishing liquid to make polishing liquids A, B, C, and D respectively.

[0040] Two, polishing examples:

[0041]

[0042] Summary: Adding an appropriate concentration of surfactant can further improve the suspension performance of the polishing fluid but will not reduce the polishing efficiency of the polishing fluid.

[0043] 2. Polish each polishing solution prepared in Example 3 on a Logitech CDP single-sided polishing machine. Pres...

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PUM

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Abstract

The invention relates the high accuracy polishing liquid and its production method and usage. The method comprises the following steps: making the cerium oxide as suspending liquid, adding other nano oxidate friction material, stirring, adjusting the pH to 4-11, and getting polishing liquid. The polishing liquid can be used to polish silicon-containing compound, oxide compound, semi-conductor, conductor, glass, or monocrystalline silicon. It has advertises of high polishing efficiency and no damaging polisher.

Description

technical field [0001] The invention relates to the composition and production process of a chemical product, in particular to the technical field of production of polishing liquid used for processing such as glass. Background technique [0002] At present, the glass polishing liquid used in the production of glass processing enterprises mainly uses large particles of cerium oxide powder as polishing friction agent, the overall polishing rate is low, the dispersion stability is poor, it is easy to cause serious surface scratches, and there are defects such as low flattening polishing efficiency . Long-time polishing often greatly reduces the polishing efficiency, resulting in rapid wear of the polishing machine, low production efficiency, and a large consumption of consumables. Contents of the invention [0003] The purpose of the present invention is to invent a high-precision composite polishing liquid with good dispersion stability, high flattening polishing efficiency...

Claims

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Application Information

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IPC IPC(8): C09G1/02
Inventor 孙韬
Owner 孙韬
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