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LED (light-emitting diode) packaging structure and packaging molding method

A technology of LED packaging and molding method, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems affecting the reliability of LED packaging, single refractive index of packaging materials, affecting the reliability of phosphors, etc., to improve the external quantum efficiency and LED reliability, uniform light output, and the effect of reducing optical power loss

Inactive Publication Date: 2012-08-15
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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Problems solved by technology

In addition, the LED chip generates a lot of heat when it is lit. Using the traditional potting process, the phosphor powder is in direct contact with the chip surface, which affects the reliability of the phosphor powder, thereby affecting the reliability of the entire LED package.
[0004] In addition, the refractive index of the LED chip material is usually above 2.0, and the refractive index of the air medium is 1. If there is only a layer of silica gel or epoxy resin transition between them, the packaging material will have a single refractive index. Due to the small total reflection angle of the LED lens , so that a large part of the light cannot be refracted out of the lens but reflected back into the lens, resulting in a large loss of optical power and reducing the external quantum efficiency

Method used

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  • LED (light-emitting diode) packaging structure and packaging molding method
  • LED (light-emitting diode) packaging structure and packaging molding method
  • LED (light-emitting diode) packaging structure and packaging molding method

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Embodiment Construction

[0020] see figure 1 , the present invention provides an LED packaging structure, which includes: LED bracket 1; LED chip 2; two metal wires 3 for connecting the LED bracket 1 and LED chip 2; multi-layer silica gel layer 60, sealed on the LED bracket 1. On the LED chip 2 and the two metal wires 3.

[0021] LED bracket 1 can be a material with good heat dissipation performance, such as metal materials such as copper, iron, silver or aluminum, or ceramic materials such as aluminum nitride and aluminum oxide. 2 electrical connections.

[0022] LED chip 2 is fixed on the surface of LED bracket 1; LED chip 2 can be a solid semiconductor chip, and its luminescent material can be blue light GaN or GaInN material, and can also be other luminescent materials that can emit red light, green light, and ultraviolet light.

[0023] Two metal wires 3 are used for the connection between the LED bracket 1 and the LED chip 2; the metal wires 3 are generally gold wires or aluminum wires with a ...

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Abstract

The invention provides an LED (light-emitting diode) packaging structure and a packaging molding method. The LED packaging structure comprises an LED support, an LED chip, two metal wires and a multilayer silica gel layer, wherein the LED chip is fixed on the surface of the LED support, and the two metal wires are used for connecting the LED support with the LED chip; and the multilayer silica gel layer covers the LED support, the LED chip and the two metal wires. The packaging structure obtained by adopting the LED packaging method provided by the invention can effectively improve LED facula and light type, so that the LED sends out light uniformly, the light power loss is reduced, the external quantum efficiency and the LED reliability are improved, and light failure is reduced.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, in particular to a light emitting diode (LED) packaging structure and packaging method. Background technique [0002] LED (light emitting diode), that is, light-emitting diode, as a new type of high-efficiency solid-state light source, has significant advantages such as long life, energy saving, and environmental protection. It is another leap in the history of human lighting after incandescent lamps and fluorescent lamps. The new lighting technology has great economic and social significance. LED packaging is to connect the outer leads to the electrodes of the LED chip to facilitate connection with other devices. The LED package protects the chip from erosion by water, air and other substances, and can also improve the light extraction efficiency of the LED chip. [0003] A key technology to realize white light LED is the coating process of phosphor powder. The thickness controllability...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L33/50H01L33/00
Inventor 卢鹏志杨华王晓彤王琳琳李璟伊晓燕王军喜王国宏
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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