LED lamp and manufacturing method thereof

Abstract

The invention discloses an LED lamp. The LED lamp comprises a substrate; a plurality of LED chips which are arranged on the substrate and are electrically connected with the substrate; a fluorescent powder layer which is arranged on the upper surfaces of the LED chips; and a first white wall glue part which is arranged on the substrate and around the LED chips, and is provided with grooves distributed between the adjacent LED chips. The fluorescent powder layer is only arranged on the upper surfaces of the LED chips, so that invalid fluorescent powder areas are greatly reduced. The first white wall glue part is provided with the grooves between the adjacent LED chips, that is, there is no fluorescent powder layer between the adjacent LED chips, so that the boundaries of the light-emitting areas of the LED lamps are very obvious, and light spots are optimized. According to the LED lamp, the use of a fluorescent sheet patch is avoided, an adhesive and a steel mesh are not needed between the LED chips and the fluorescent powder layer, the manufacturing cost is reduced, the light emitting efficiency is improved, meanwhile, fluorescent glue is prevented from overflowing, and the attractiveness of the LED lamp is improved. The invention further provides a manufacturing method with the advantages.

Description

technical field [0001] The present application relates to the technical field of lighting, in particular to an LED lamp and a manufacturing method thereof. Background technique [0002] LED (Light-Emitting Diode, light-emitting diode) is made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc. It is a semiconductor component and is widely used in various indications, Display, decoration, backlight, general lighting and urban night scenes and other fields. [0003] During the production process, the LED chip needs to be covered with a phosphor layer. Currently, there are several methods: the first method, the overall spraying, the phosphor layer not only covers the LED chip, but also covers the area corresponding to the substrate other than the LED chip; the second method 1. Use steel mesh to block the area other than the LED chip, and spray phosphor powder on the LED chip area; the third method is to use a fluorescent sheet patch to stick ...

AI Technical Summary

Problems solved by technology

These methods all have various disadvantages. In the first method, the ineffective phosphor area is large, and there is a phosphor layer between adjacent LED chips, and the boundary of the light spot is not obvious, which makes it difficult to deal with the light spot at the application end; In the second method, phosphor glue will seep into the connection between the steel mesh and the substrate, resulting in poor appearance and uneven color temperature of the LED lamp. Moreover, the steel mesh is a consumable material, which makes the production cost high. At the same time, manual alignment of the steel mesh is required, which is accurate In the third way, adhesives are needed to bond between the fluorescent sheet patch and the LED chip, which will reduce the light output efficiency of the LED lamp, and the production cost and purchase cost of the fluorescent sheet patch are high, resulting in high cost of the LED lamp. , and the process of pasting the fluorescent sheet on the LED chip is complicated, which requires high equipment precision and the color temperature change is relatively rigid

Images