Fluorine-containing composition, and membrane thereof
A composition and polymer technology, applied in the field of fluorine-containing polymers, can solve problems such as limitation, reduction of resin yield and accumulation, achieve excellent alkali resistance and processing performance, increase resin yield, and reduce production costs Effect
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Embodiment 1
[0019] 70 parts of polyvinylidene fluoride homopolymer powder, 1 part of polytetrafluoroethylene superfine powder with a weight average molecular weight of 5000 and an average particle diameter of 0.01 μm, 1 part of titanium dioxide, 0.01 part of isopropyl tri(dioctyl pyrophosphate Acyloxy) titanate coupling agent, after high-speed mixing, thermoplastic processing and granulation at 200-220 ° C, and then extruded into a film with an average thickness of 5 μm through an extruder at 210-230 ° C, and rolled. During the processing, there is no bonding at the die mouth, no accumulation of material, and a high film forming rate.
Embodiment 2
[0021] 100 parts of vinylidene fluoride-hexafluoropropylene copolymer powder, 20 parts of polytetrafluoroethylene superfine powder with a weight average molecular weight of 200,000 and an average particle diameter of 20 μm, 30 parts of silicon dioxide, and 5 parts of γ-aminopropyltriethyl Oxysilane coupling agent, after high-speed mixing, it is granulated by thermoplastic processing at 180-210 ° C, and then extruded by an extruder at 200-230 ° C to form a film with an average thickness of 10 μm, and it is wound. During the processing, there is no bonding at the die mouth, no accumulation of material, and a high film forming rate.
Embodiment 3
[0023] 90 parts of polyvinyl fluoride copolymer powder, 10 parts of polytetrafluoroethylene superfine powder with a weight average molecular weight of 100000 and an average particle diameter of 10 μm, 15 parts of calcium carbonate, 2 parts of isopropoxy aluminate, 10 parts of methyl acrylate Ester-methyl methacrylate copolymer, after high-speed mixing, heat-plasticized at 180-210°C for granulation, then extruded by extruder at 200-230°C to form a film with an average thickness of 50 μm, and rolled. During the processing, there is no bonding at the die mouth, no accumulation of material, and a high film forming rate.
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