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Inducer

An inductor and electrical connection technology, applied in the field of inductors, can solve the problems of increased overall height, inability to reduce overall height, unfavorable thin design, etc.

Active Publication Date: 2012-07-18
CYNTEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the height of the external lead frame will increase the overall height of the integrated
[0006] Therefore, under the condition that the required inductance value is the same, when the existing inductor is packaged with the IC chip, the overall height cannot be reduced, which is not conducive to thinner design

Method used

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Embodiment Construction

[0036] Please refer to Figure 1 to Figure 3 , figure 1 It is a combined schematic diagram of an inductor 1 and an IC chip packaging structure 3 according to an embodiment of the present invention, figure 2 yes figure 1 Exploded diagram of inductor 1 in, image 3 yes figure 1 Front view of inductor 1 in . Inductor 1 is a passive electronic component that stores energy generated by a current passing through a magnetic field. Such as Figure 1 to Figure 3 As shown, the inductor 1 includes a first core material 10 , a wire 12 , a second core material 14 and two first lead frames 16 . The material of the first core material 10 and the second core material 14 can be iron powder, iron oxide compound, permanent magnet or other magnetic materials. The shapes of the first core material 10 and the second core material 14 are not limited to the rectangle shown in the figure, and can be designed into other shapes according to practical applications, such as circle, ellipse, polygo...

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Abstract

The invention discloses an inducer, which comprises a first core, a lead, a second core and a first lead frame. The first side of the first core is provided with a holding space, the second side of the first core is provided with a recess, and the first side is opposite to the second side. The first core is at the first height, the lead is arranged in the holding space, the second core is arranged on the first side of the first core and covers the holding space, and the first lead frame is provided with an embedded portion which is embedded in the recess and at the second height. The total height of the embedded portion and the first core is smaller than the total height of the first height and the second height after the embedded portion is embedded in the recess of the first core. The lead frame of the inducer is embedded in the first core, and when the inducer and an IC (integrated circuit) chip are integrated and packaged systemically, the integral height can be reduced effectively and thinning design of electronic products is benefited.

Description

technical field [0001] The invention relates to an inductor, in particular to an inductor capable of system integration package (System-In-Package, SIP) with an IC chip. Background technique [0002] An inductor is a passive electronic component that stores energy generated by a current passing through a magnetic field. The inductance value is used to measure the ability of an inductor to store magnetic energy. Inductors are generally wound into coils with wires, and according to Faraday's Law of Induction, the number of turns of wires can enhance the magnetic field in the coil. Inductance is created by the magnetic field formed around a current-carrying conductor, which has a tendency to resist changes in current. The number of turns of the wire, the cross-sectional area of ​​the wire, and the material of the wire all affect the inductance value. For example, using high permeability magnetic material (such as iron oxide compound) to wrap the conductor will increase the ma...

Claims

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Application Information

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IPC IPC(8): H01F17/04H01F27/24H01F27/30
CPCH01F27/24H01F27/2823H01F27/29
Inventor 吴宗展
Owner CYNTEC
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