Process for improving content stability of soldering flux for solder, and device for vertically injecting soldering flux for solder

Abstract

The invention relates to a process and a device for injecting soldering flux, which are suitable for a core solder wire. The process comprises the following steps of: putting the soldering flux into a brazing filler metal barrel; heating the brazing filler metal barrel to melt the soldering flux, and keeping temperature stable; injecting the melted soldering flux at the bottom of the brazing filler metal barrel into a colophony nozzle; vertically injecting the soldering flux from the colophony nozzle into a soldering flux hole in the center of solder by the colophony nozzle; and extruding the solder from an outlet of an outlet module for molding. The device for vertically injecting the soldering flux for the solder comprises an extruder, the brazing filler metal barrel, and the colophony nozzle; the brazing filler metal barrel comprises conduction oil, a thermocouple, and a heating tube; a channel is formed at the bottom of the brazing filler metal barrel and is communicated with the colophony nozzle; the top of the colophony nozzle is extended into a solder bar extrusion cavity of the extruder and near the solder outlet mould; the brazing filler metal barrel is placed on the top of the extruder; the colophony nozzle is vertically extended into the solder bar extrusion cavity of the extruder; and the problem of low solder quality caused by content fluctuation of the soldering flux in the production process of the solder can be solved.

Description

technical field [0001] The invention relates to a flux filling process and a device thereof, which are suitable for the production of cored solder wires. Background technique [0002] The surface of most metal materials in the atmosphere will be covered by a layer of oxide film. When brazing, if there is an oxide film on the surface of the base metal, it cannot be wetted by the liquid solder; similarly, if the liquid solder is wrapped by the oxide film, it cannot spread on the base metal. Therefore, in order to complete the brazing process and obtain high-quality joints, it is very important to completely remove the oxide film on the surface of the base metal and the solder. In some cases, the process of removing the oxide film on the surface of the base metal is also arranged before brazing, but this is far from meeting the requirements. This is because during the brazing heating process, the surface of the base metal and the molten solder is also faced with more rapid ox...

AI Technical Summary

Problems solved by technology

[0005] The invention provides a technique for improving the stability of solder flux content in tin wires and a vertical filling device for solder flux in tin wires, which solves the defect of poor quality of tin wires caused by fluctuations in flux content in the production of tin wires, and eliminates the need for operators to dredge solder The safety hazard of being easily scalded by high-temperature liquid flux when the flux is injected into the channel, and the problem of waste of flux

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