Conductive particles, anisotropic conductive film, assembly, and connection method

Abstract

Disclosed are: conductive particles which can be prevented from being aggregated, can damage oxide coating films on the surfaces of electrodes in circuit members upon the connection the circuit members to each other, and can achieve high connection reliability; and an anisotropic conductive film, an assembly, and a connection method each utilizing the conductive particles. Each of the conductive particles comprises a core particle and a conductive layer formed on the surface of the core particle, wherein the core particle is a nickel particle, the conducive layer is a nickel-coated layer having a phosphorus concentration of 10 mass% or less in the surface part thereof, and the conductive layer has an average thickness of 1 to 10 nm.

Description

technical field [0001] The present invention relates to a conductive particle, an anisotropic conductive film using the conductive particle, a bonded body, and a connection method. Background technique [0002] Circuit components such as the connection between a liquid crystal display and a Tape Carrier Package (TCP), the connection between a Flexible Printed Circuit (FPC) and a TCP, or the connection between an FPC and a Printed Wiring Board (PWB) For connection between them, a circuit connection material (for example, an anisotropic conductive film) in which conductive particles are dispersed in a binder resin is used. In addition, recently, when mounting a semiconductor silicon chip on a substrate, in order to connect circuit components, the semiconductor silicon chip is flip-chip mounted directly on the substrate without using wire bonding, and so-called flip chip assembly is performed. In this flip chip assembly, circuit connection materials such as anisotropic conduct...

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Problems solved by technology

[0006] However, the conductive particles of (1) above have elastic deformability because the core particles are resin, so even if the nickel plating layer has protrusions, it cannot be damaged due to the hardness of the circuit board formed on the electrode surface in the circuit components. Oxide film, and there is a problem of lower connection reliability

[0007] In addition, the electroconductive particle of the surface of the nickel core particle described in (2) is gold-plated because the Mohs hardness of the gold formed on the surface is as low as 2.5, so the oxide film on the electrode surface in the circuit component cannot be destroyed, and there is a connection reliability. problem of getting low

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