Full-automatic electroplating production line for semi-conductor lead frames

Abstract

A full-automatic electroplating production line for semi-conductor lead frames comprises an automatic feeding mechanism, a conveying mechanism, a preprocessing part, an electroplating bath, a post-processing part and an automatic discharging mechanism, wherein the automatic feeding mechanism and the automatic discharging mechanism are mainly driven pneumatically; the processing baths and the electroplating baths of the preprocessing part, as well as the processing baths of the post-processing part, are arranged side by side with the bath walls jointed with each other; and the conveying mechanism is a chain conveying mechanism. The invention has the benefits as follows: equipment is compact and occupies small land, the maintenance is convenient, the technology is reliable, the electroplated product quality is good, the efficiency is high, the processing capacity is large, and the effects of water conservation, electricity conservation and environment friendliness are achieved; owing to specially arranged shielding baffles, specially designed horizontal belts externally coated and electroplated with insulating gel, and specially designed spring leaf clamps, a complex deplating process is saved, so that the production cost and the manpower cost are greatly saved; and through appropriate changes in intervals of the horizontal belts and the configuration of the spring leaf clamps, the full-automatic electroplating production line can be suitable for various packaging forms and electroplating of various types of strip materials.

Description

technical field [0001] The invention belongs to the technical field of electroplating, in particular to a fully automatic production line for electroplating semiconductor lead frames. Background technique [0002] After the semiconductor lead frame is epoxy-encapsulated, it needs to be tin-plated on its surface for the purpose of solderability and device protection. The electroplating methods in the prior art mainly include Hanging Plating and High Speed ​​Plating. Other methods such as barrel plating and spray plating are limited by the feasibility and efficiency of the method and are not widely used. [0003] Rack plating is currently the most widely used electroplating method in various industries. Its advantages are wide adaptability, reliable method, convenient adjustment of process parameters and easy maintenance. The rack plating automatic production line designed and developed in recent years uses 2-3 cranes above the electroplating tank to control the take-off and ...

AI Technical Summary

Problems solved by technology

Deplating not only consumes the deplating solution, but also wastes anode raw materials and increases the cost. Deplating will also increase the corrosion of hangers, steel strips and spring clips, which need to be replaced regularly. More importantly, nitric acid is often used in the deplating process system, poor operating environment, serious environmental pollution, large amount of wastewater

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