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Photosensitive element

A photosensitive and photosensitive resin technology, applied in the directions of optics, optomechanical equipment, and photosensitive materials for optomechanical equipment, etc., can solve the problems of contamination of optics, exposure of photosensitive layers, and difficulty in removing optics, and achieve excellent results. Excellent resolution and peelability

Active Publication Date: 2012-02-22
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the photosensitive layer usually has a certain degree of adhesion, when the optical tool is directly attached to the photosensitive layer for exposure, it is not easy to remove the attached optical tool.
In addition, the photosensitive layer will pollute the optical tool, and peeling off the support film will cause the photosensitive layer to be exposed to oxygen in the atmosphere, which will easily lead to a decrease in photosensitivity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0138] As a supporting film, a polyethylene terephthalate (hereinafter referred to as "PET") film (manufactured by Toyobo Co., Ltd., trade name "A-1517", thickness 16 μm) was prepared. Next, the above-prepared photosensitive resin composition containing the binder polymer (I) was coated on the PET film to make the thickness uniform, and dried with a hot air convection dryer at 100° C. for 2 minutes to remove the solvent to form a photosensitive layer. After drying, the photosensitive layer was covered with a polyethylene film (manufactured by Tamapoly, trade name "NF-15", thickness 20 μm) as a protective film to obtain a photosensitive element. In addition, the thickness of the photosensitive layer after drying was 25 μm.

Embodiment 2

[0140] A photosensitive element was obtained in the same manner as in Example 1 except that the photosensitive resin composition containing the binder polymer (II) was used instead of the photosensitive resin composition containing the binder polymer (I). . The thickness of the photosensitive layer after drying was 25 μm.

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PUM

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Abstract

The present invention relates to a photosensitive element, wherein the haze of the support film (10) is no greater than 1.0% and the surface resistivity of the second main side (14) opposite the first main side (12) of the support film (10) is no greater than 1013 Omega, and the layer (20) composed of the photosensitive resin composition contains a photopolymerizing compound, a photopolymerization initiator and a binder polymer comprising a compound represented by the following general formula (I) and (meth)acrylic acid as monomer units. H2C-CR1-COOR2 (I) [In formula (I), R1 represents hydrogen or a methyl group, and R2 represents a C3-7 alkyl group].

Description

[0001] This application is a divisional application of a Chinese patent application whose filing date is December 7, 2007, application number 200780046670.5, and invention name "photosensitive element". technical field [0002] The present invention relates to a photosensitive element. Background technique [0003] Conventionally, in the field of manufacturing printed circuit boards, as a resist material for etching, plating, etc., a layer composed of a photosensitive resin composition (hereinafter referred to as "photosensitive layer"), a support film, and a protective film The photosensitive element constituted has been widely used. A printed circuit board is manufactured, for example, in the following manner. First, the protective film of the photosensitive element is peeled off from the photosensitive layer, and then the photosensitive layer is laminated on the conductive film of the circuit-forming substrate. Next, pattern exposure is performed on the photosensitive l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/09G03F7/033
CPCG03F7/033G03F7/004G03F7/0045G03F7/09
Inventor 久保田雅夫
Owner RESONAC CORP
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