Technology for manufacturing ceramic cofiring four-side lead flat package

Abstract

The invention discloses a technology for manufacturing a ceramic cofiring four-side lead flat package, comprising the following steps of: manufacturing a ceramic package main body; processing a flat lead; welding the flat lead with a ceramic part by welding fluxes; plating a layer of gold on the flat lead and the ceramic part; coating a protective material on the lead surface; cutting off connecting parts of four sides of the flat lead; bending and forming the lead; and giving the qualified products after check to a user. The technology has the beneficial effects that the steps of cutting and bending the leads by the user in the traditional technology for manufacturing a ceramic cofiring four-side lead flat package are conducted before a package-manufacturing stage, that is, the step of bending and forming the leads is carried out in the process of manufacturing the packages, thus solving the defects that the user operation is complicated, the rate of finished products is low and the leads are scrapped easily in the process of bending and forming the leads in the traditional technology, and improving the use convenience of the user.

Description

technical field [0001] The invention relates to a manufacturing process, in particular to a manufacturing process of a ceramic co-fired four-sided lead flat shell, which is suitable for the packaging field of large-scale integrated circuit chips. Background technique [0002] The high-temperature co-fired ceramic four-sided leaded shell includes porcelain parts, leads, sealing areas, heat sinks, etc. The traditional manufacturing process is to solder the leads to the porcelain parts as the input and output ends of the packaged integrated circuit chips, and then deliver them to the user. The user carries out chip bonding, bonding, sealing and other packaging processes, and then the user cuts and bends the leads according to the requirements. During the bending and forming process of the leads, it is very easy to cause the porcelain parts to break and lead wires to break. Defects such as deformation, resulting in scrap. Generally, the molding quality is improved by improving ...

AI Technical Summary

Problems solved by technology

[0002] The high-temperature co-fired ceramic four-sided leaded shell includes porcelain parts, leads, sealing areas, heat sinks, etc. The traditional manufacturing process is to solder the leads to the porcelain parts as the input and output ends of the packaged integrated circuit chips, and then deliver them to the user. The user carries out chip bonding, bonding, sealing and other packaging processes, and then the user cuts and bends the leads according to the requirements. During the bending and forming process of the leads, it is very easy to cause the porcelain parts to break and lead wires to break. Defects such as deformation, resulting in scrap

Generally, the molding quality is improved by improving the molding die, but the cost is high and the quality is unstable