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Magnetic water separation type planar magnetron sputtering target

A magnetron sputtering and separation technology, which is applied in the field of magnetic water separation planar magnetron sputtering targets, can solve the problems of uneven magnetic field, burnout of the target material, uneven sputtering coating, etc., and achieves improved temperature stability. , prolong the service life and improve the effect of coating quality

Inactive Publication Date: 2012-01-25
衡阳市真空机电设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the central permanent magnet block 9 and the side permanent magnet block 11 are connected to the circulating water, and the central permanent magnet block 9 and the side permanent magnet block 11 are a rare earth neodymium-iron-boron (NdFeB) alloy, although its magnetic properties are excellent, But its disadvantage is poor corrosion resistance. Although the surface is protected by a nickel layer, during the assembly process of the magnetic circuit, the corners of the permanent magnet block or the nickel layer on the local surface are slightly damaged, resulting in local corrosion of the permanent magnet block. After a long time, The whole piece of permanent magnet powder is powdered, which makes the magnetic field in front of the target surface fluctuate, resulting in uneven sputtering coating, and the permanent magnet block has to be replaced; at the same time, the powdered permanent magnet powder is also easy to block the water channel, resulting in poor water flow , the cooling effect becomes worse, and the target material 7 and the lower sealing ring 13 may be burnt seriously, causing an accident
Since rare earth elements are an increasingly rare resource, the price is high, resulting in high production costs (economic costs, time costs) and poor coating quality

Method used

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  • Magnetic water separation type planar magnetron sputtering target
  • Magnetic water separation type planar magnetron sputtering target
  • Magnetic water separation type planar magnetron sputtering target

Examples

Experimental program
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Effect test

Embodiment 1

[0021] Such as Figure 5 , 6 As shown, a magnetic-water separation planar magnetron sputtering target includes a cooling water inlet pipe 1, a cooling water outlet pipe 2, a magnetic guide plate 3, a cathode body 4, a target pressure ring 5, a screw 6, a target material 7, and a center The pole shoe 8, the central permanent magnet block 9, the side pole shoe 10, the side permanent magnet block 11 and the lower sealing ring 13, the magnetic guide plate 3, the cathode body 4, the target pressure ring 5 and the target material 7 are all circular. There are through holes through which the cooling water inlet pipe 1 and the cooling water outlet pipe 2 pass through on the magnetic plate 3, which is located on the top of the cathode body 4, the target pressure ring 5 and the target material 7 are located under the cathode body 4, the magnetic guide plate 3, the cathode body 4 and the target pressure ring 5 are fixed by screws 6. The lower sealing ring 13 is located between the catho...

Embodiment 2

[0023] Such as Figure 7 , 8 Shown: a magnetic-water separation planar magnetron sputtering target, including a cooling water inlet pipe 1, a cooling water outlet pipe 2, a magnetic guide plate 3, a cathode body 4, a target pressure ring 5, a screw 6, a target material 7, and a center Pole shoe 8, central permanent magnet block 9, side pole shoe 10, side permanent magnet block 11 and lower sealing ring 13, magnetic conductive plate 3, cathode body 4, target pressure ring 5 and target material 7 are all rectangular, magnetically conductive There are through holes through which the cooling water inlet pipe 1 and the cooling water outlet pipe 2 pass through on the plate 3, which is located on the top of the cathode body 4, the target pressure ring 5 and the target material 7 are located under the cathode body 4, the magnetically conductive plate 3, the cathode body 4 and the target pressure ring 5 are fixed by screws 6, and the lower sealing ring 13 is located between the cathod...

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Abstract

The invention discloses a magnetic water separation type planar magnetron sputtering target, which comprises a cooling water feeding pipe 1, a cooling water draining pipe 2, a concentrating flux plate 3, a cathode body 4, a target pressure ring 5, a boult 6, a target 7, a central pole shoe 8, a central permanent magnet block 9, a tip pole shoe 10, a tip permanent magnet block 11 and a lower sealing ring 13, wherein the cathode body 4 is provided with an annular rectangular groove 41; a circular blind hole 42 is formed in the center of the cathode body 4; the circle center of the annular rectangular groove 41 is superposed with that of the circular blind hole 42; the cooling water feeding pipe 1 and the cooling water draining pipe 2 upwards penetrate through the through holes on the concentrating flux plate 3 and the cathode body 4 and are sealed with the cathode body 4 by using a water pipe sealing ring 43; the central pole shoe 8 and the central permanent magnet block 9 are positioned in the circular blind hole 42; and the tip pole shoe 10 and the tip permanent magnet block 11 are positioned in the annular rectangular groove 41. A novel structure of separating a cathode magnetic path from a cooling water path is adopted in the magnetic water separation type planar magnetron sputtering target, so that the service life of a magnet is greatly prolonged; and meanwhile, cooling water cannot be polluted or blocked, and the quality of a plated film is stably improved.

Description

technical field [0001] The invention relates to a vacuum magnetron sputtering coating device in the field of new materials, in particular to a magnetic-water separation type planar magnetron sputtering target. Background technique [0002] Since the birth of magnetron sputtering technology in the 1970s, great progress has been made in the high-speed preparation of metal, semiconductor and dielectric films, and it is widely used in the fields of semiconductor devices, integrated circuit miniaturization and optical devices. The solar energy utilization and energy-efficient films involved, whether it is an all-glass vacuum heat collector, an all-metal flat plate collector, or a high-temperature heat collector as the core component of solar thermal power generation, all use magnetron sputtering film-making technology in the research and development process. , and one of the key equipment is the cylindrical and planar magnetron sputtering targets. Due to the high-temperature-res...

Claims

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Application Information

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IPC IPC(8): C23C14/35
Inventor 李云辉李云松华冬辉
Owner 衡阳市真空机电设备有限公司
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