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Method for surface treatment by developing machine after electronic circuit board anti-soldering process

An electronic circuit board, surface treatment technology, applied in the direction of secondary treatment of printed circuits, etc., can solve the problems of increasing the overflow of composite washing, SMONPAD, increasing the amount of pure water, etc., to improve the yield of PCB production, reduce SMONPAD, The effect of increasing the speed of the developing machine

Active Publication Date: 2011-12-14
GULTECH WUXI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0019]1. There are a total of 19 nozzles arranged on the spray plate, and the height from the nozzle to the PCB surface is 19CM. The arrangement of the spray plate is unreasonable, and the spraying is uneven. The surface distance is too large and the spray pressure is insufficient, resulting in the ink at the bottom of the blind hole cannot be developed cleanly and the 13.8mils through hole is blocked, resulting in scrap
Insufficient developing nozzles, slow developing speed and insufficient efficiency
[0020] 2. The solid water blocking roller driven by the developing line will stain the developed ink chips on the copper surface, causing SM ON PAD on the copper surface
[0021] 3. The water washing pressure of the new developing solution is insufficient, and the residual sodium carbonate solution on the surface of the developing tank cannot be thoroughly cleaned, and a small amount of sodium carbonate solution will be brought into the high-pressure washing and composite washing sections of the rear section, resulting in crystallization in the washing section, resulting in Dirty PCB surface
[0022] 4. Due to the poor configuration of the developing machine, it will cause scrapping defects such as unclean copper surface, ink plugging, SM ON PAD, ink residue at the bottom of blind holes, etc., which will affect PCB yield
Slow developing speed and insufficient efficiency
[0023] 5. The pressure of the first water washing in the developing tank is insufficient, and a small amount of sodium carbonate solution will be brought into the high-pressure water washing and compound water washing sections of the rear section, which will cause water washing pollution. After washing pollution, it is necessary to increase the overflow flow of compound water washing and increase the amount of pure water

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] The invention discloses a method for surface treatment of an electronic circuit board using a developing machine after the anti-soldering process, using the following process steps:

[0067] 1. Preparation of sodium carbonate solution: prepare sodium carbonate solution by Na2CO3 and tap water; wherein: Na2CO3 19kg, tap water 1900L, add Na2CO3 19kg and tap water 1900L into a bath and stir for 30 minutes, Na2CO3 is completely dissolved and ready to use; the sodium carbonate The purity of Na2CO3 in the solution is: 99.2%.

[0068] 2. One-tank development process

[0069] The PCB board is horizontally driven into the developing machine through the rollers, and the sodium carbonate solution arranged in the first developing tank is pumped out to spray the sodium carbonate solution onto the PCB surface through the nozzle on the spray plate, and the PCB is sprayed under the pressure of the sodium carbonate spray. The unexposed copper side of the board and the ink in the holes ...

Embodiment 2

[0096] The method of the present invention uses a developing machine for surface treatment of an electronic circuit board after the anti-soldering process, including the following process parameters: the purpose of the present invention can also be achieved by using the equipment and process steps in Embodiment 1.

[0097] 1. Prepare sodium carbonate solution: prepare sodium carbonate solution by Na2CO3 and tap water; wherein: Na2CO3 15.2kg, tap water 1900L, add Na2CO3 19kg and tap water 1900L into a bath and stir for 30 minutes, Na2CO3 dissolves completely and is ready to use; The purity of Na2CO3 in sodium solution is: 99.2%.

[0098] 2. One-tank development process

[0099] The height of the nozzle from the PCB board is 13CM. The weight percent concentration of sodium carbonate in the sodium carbonate solution is: 0.8%, and the developing time of the sodium carbonate solution is: 25S / piece. The temperature of the sodium carbonate solution is: 28°C, and the spraying pressu...

Embodiment 3

[0125] A method of using a developing machine for surface treatment of an electronic circuit board according to the present invention includes the following process parameters: the purpose of the present invention can also be achieved by using the equipment and process steps in Embodiment 1.

[0126] 1. Prepare sodium carbonate solution: prepare sodium carbonate solution by Na2CO3 and tap water; wherein: Na2CO3 20.9kg, tap water 1900L, add Na2CO3 19kg and tap water 1900L into a bath and stir for 30 minutes, Na2CO3 dissolves completely and is ready for use; The purity of Na2CO3 in sodium solution is: 99.2%.

[0127] 2. One-tank development process

[0128] The height of the nozzle from the PCB board is 13CM. The weight percent concentration of sodium carbonate in the sodium carbonate solution is: 1.2%, and the developing time of the sodium carbonate solution is: 30S tablets. The temperature of the sodium carbonate solution is: 32°C, and the spraying pressure of the developing...

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PUM

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Abstract

The invention relates to a method for carrying out surface processing on an electronic circuit board (PCB) by a developing machine after welding prevention processing, which comprises the following procedures of processing by a first developing trough, primary wind pressure tube water prevention, processing by a second developing trough, secondary wind pressure tube water prevention, processing by a third developing trough, tertiary wind pressure tube water prevention, medium pressure washing, processing by a punching water jet scalpel, composite washing, processing by a sponge roller, cold air drying, hot air drying, inspection and the like. In the invention, after spray disks of the developing troughs are structurally regulated and the punching water jet scalpel is added, no residual ink is generated at the bottom of a blink hole and no phenomenon of poor hole blockage of a through hole is generated; by a wind pressure water prevention mode, the defect that after the ink is rolled by the roller, the copper surface of the PCB is stained with the ink can be improved and the amount of printing ink on pad can be reduced; the water using amount can be saved; the speed of the developing machine can be improved, the production efficiency is promoted, the scrappage is reduced and the yield rate of the PCB can be promoted.

Description

technical field [0001] The invention relates to a method for surface treatment of an electronic circuit board (PCB) after the anti-soldering process by using a developing machine, and specifically belongs to the technical field of PCB production and manufacturing. Background technique [0002] In the solder mask process of the circuit board (PCB) industry, it is necessary to print all the PCB boards with ink first. In the exposure process, the part of the ink used for the solder mask in the SMT process is exposed and polymerized by UV. In the SMT process, copper pads for welding parts are required. Or the hole ring of the inserted part does not do UV exposure. Through the principle that the ink without exposure polymerization can be dissolved into weak alkali, the exposed PCB is developed by the developing machine in the way of roller transmission, and through the principle that the ink can dissolve into weak alkali, the developing machine is equipped with 0.8-1.2% concentra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/22
Inventor 唐进
Owner GULTECH WUXI ELECTRONICS CO LTD
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