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Plating solution and plating method

A technology of copper electroplating solution and reaction products, which is applied in the field of electroplating copper and electroplating metal, can solve the problems of not being able to provide smooth copper deposition, and achieve the effect of reducing nodules and good dispersion ability

Active Publication Date: 2011-12-14
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Current bath additives (particularly current levelers) do not provide planar copper deposition on substrates and effectively fill through-holes and / or blind vias

Method used

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  • Plating solution and plating method
  • Plating solution and plating method
  • Plating solution and plating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] Resorcinol diglycidyl ether (94.5 mmol), 150 mmol of imidazole and 10 mL of diethylene glycol were added to a round-bottom reaction flask placed in a thermal bath at room temperature. Then 40 mL of DI water was added to the reaction vial. The temperature of the heating bath was set to 98°C. The initially formed white suspension eventually dissolved and formed a clear amber solution as the reaction temperature was increased. The reaction mixture was then heated for 5 hours and left to stir at room temperature for an additional 8 hours. The reaction product (reaction product 1) was used without purification. The characteristic parameters of the reaction products are shown in Table 1. Stock solutions of this product were prepared in water as solvent.

Embodiment 2

[0066] Add 2,4-dimethylimidazole (100mmol), 56.7mmol 1,4-butanediol diglycidyl ether and 6.3mL resorcinol diglycidyl ether to a round bottom reaction flask placed in a thermal bath at room temperature . Then 15 mL of DI water was added to the reaction flask. The temperature of the heating bath was set to 95°C. The mixture was then heated for 6 hours and left with stirring at room temperature for an additional 8 hours. The reaction product (amber) was used without purification (reaction product 9). The characteristic parameters of the reaction products are shown in Table 1. A stock solution of this product was prepared in DI water as solvent.

Embodiment 3

[0068] Reaction products 2-8 were prepared according to the steps of Example 1 or 2. The molar ratios and characteristic parameters of the components are shown in Table 1. Measure the UV absorption spectrum of the reaction product in water using an Agilent 8453 spectrophotometer and record λ in the following table max (nm).

[0069]

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Abstract

Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using suchcopper plating baths are also disclosed. A reaction product of one or more nitrogenous compounds and one or more epoxy compounds indicated in formula 1 or 2 is also provided, wherein Y1 and Y2 are selected from H and (C1 - C4) alkyl group. Z is Ar, R12OarOR12, (R13O)aAr (OR13)A, Cy, R12CyR12 or (R13O)aCy(OR12)A; r=1-4; Ar=(C6-C18) aryl group; Cy=(C5-C12) naphthenic group; each R12 indicates (C1-C8) alkyl group; each R13 indicates (C2-C6) alkylene oxygen group; each a=1-10; and A indicates C5-C12 naphthenic group.

Description

technical field [0001] The present invention relates to the field of electroplating metals. In particular, the invention relates to the field of electroplating copper. Background of the invention [0002] Methods of electroplating a metal-coated workpiece generally involve passing an electrical current between two electrodes in a bath, with the workpiece being one of the electrodes being plated. A typical acidic copper plating bath includes dissolved copper (usually copper sulfate), an acidic electrolyte such as sulfuric acid in a concentration sufficient to give the bath sufficient conductivity, and appropriate additives to promote plating uniformity and metal deposit quality. Such additives include accelerators, levelers, and inhibitors. [0003] Copper plating baths are used in different industrial applications, such as decorative and anti-corrosion coatings, and in the electronics industry, especially printed circuit board and semiconductor manufacturing. For printed ...

Claims

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Application Information

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IPC IPC(8): C08G59/50C08G59/40C08G59/24C08G59/22C25D3/38H05K3/18H05K3/42
CPCC07D333/04C07D295/13H05K3/421C25D3/38C07D233/60C07D295/088C07D233/02H05K3/423
Inventor Z·I·尼亚齐比托瓦
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC
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