Method for performing microprocessing by utilizing laser cavitation micro jet flow

Abstract

The invention discloses a method for performing microprocessing by utilizing laser cavitation micro jet flow. The method comprises the following steps of: 1) placing a workpiece to be processed into liquid; 2) focusing laser beams in liquid near the workpiece through a lens group and generating cavitation effect at the focal point; 3) triggering high-speed microjet flow pointing to the workpiece by the cavitation effect and generating high-strength micro shock wave; 4) impacting the high-speed micro jet flow to the surface of the workpiece to form extremely high pressure intensity to damage a material on the surface of the workpiece and removing the material on the surface of the workpiece under the synergism of the high-speed microjet flow and micro shock wave; and 5) processing a fine surface structure on the workpiece under the action of continuous laser pulse and longitudinal or transverse feed of a laser head. Compared with the laser etching technique in the prior art, the method has the advantages of avoiding thermal damage of the workpiece due to low heat effect, not generating phenomenon of depositing processing splash again in the processing process, achieving higher processing precision and contributing to improving processing efficiency.

Description

technical field [0001] The invention relates to a micromachining method for fine surface structures such as microholes and microgrooves, in particular to a micromachining method using laser cavitation microjet flow. Background technique [0002] In the prior art, the processing of micro-surface structures such as micro-holes and micro-grooves is usually completed by laser etching technology. In laser etching technology, since the laser beam emitted by the solid-state laser has more excellent characteristics, the precision and efficiency of laser micromachining can reach a higher level. At present, high-quality small holes with a diameter of tens of microns and a diameter-to-depth ratio of one to tens can be processed by using laser etching technology. When a femtosecond pulsed laser is used, even small holes and microstructures with a size of nanometers can be processed. In addition to laser etching, some novel laser processing technologies have also emerged in recent year...

AI Technical Summary

Problems solved by technology

[0003] However, since the principle of the above-mentioned laser processing technology is the vaporization and removal of materials, the existence of thermal effects will cause thermal damage to the workpiece during the processing process. In addition, the re-deposition of processing spatter has a certain impact on processing accuracy and processing efficiency.

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