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Lead-free solder

A lead-free solder, weight percentage technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of easy oxidation and corrosion, poor wettability, etc., and achieve good mechanical and electrical properties and good mechanical properties , The effect of reducing the amount of Ag

Inactive Publication Date: 2011-11-09
NINGBO ZHUOCHENG SOLDER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that Zn is relatively active, easy to oxidize and corrode, and must be reflowed in nitrogen, and the wettability is extremely poor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0012] The lead-free solder of the present embodiment is made up of the composition of following percentage by weight:

[0013] Ag: 0.6%, Cu: 0.4%, Bi: 1%, P: 0.0002%, Ce: 0.02%, Ni: 0.05%, and the balance is Sn.

[0014] The product obtained by the formula has a melting temperature of 210-215° C., a tensile strength of 80 MPa, and an elongation of 70%.

specific Embodiment 2

[0015] The lead-free solder of the present embodiment is made up of the composition of following percentage by weight:

[0016] Ag: 0.7%, Cu: 0.5%, Bi: 2%, P: 0.0003%, Ce: 0.05%, Ni: 0.1%, and the balance is Sn.

[0017] The product obtained by the formula has a melting temperature of 205-210° C., a tensile strength of 82 MPa, and an elongation of 75%.

specific Embodiment 3

[0018] Specific embodiment three: the lead-free solder of the present embodiment is made up of the composition of following percentage by weight:

[0019] Ag: 0.8%, Cu: 0.6%, Bi: 3%, P: 0.0005%, Ce: 1%, Ni: 0.12%, and the balance is Sn.

[0020] The product obtained by the formula has a melting temperature of 200-205° C., a tensile strength of 85 MPa, and an elongation of 78%.

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Abstract

The invention discloses a newly developed lead-free solder, and in particular relates to a low-cost and high-performance lead-free solder for microelectronic package. The lead-free solder is characterized by comprising the following components by weight percentage: 0.5-1% of Ag, 0.3-0.7% of Cu, 1-3% of Bi, 0.0002-0.0005% of P, 0.01-1% of Ce, 0.01-0.15% of Ni and the balance of Sn. The lead-free solder meets the dual requirements of the market for no lead and benefit. The lead-free solder provided by the invention has the characteristics of no toxicity, good mechanical properties, good electrical properties, excellent oxidation resistance, excellent corrosion resistance, good creep fatigue resistance, good wettability, good spreadability, high solder joint reliability, low cost, good mechanical properties and the like.

Description

technical field [0001] The invention belongs to the field of solder used for soldering, and relates to a soldering material, more specifically a lead-free solder for microelectronic packaging. Background technique [0002] At present, the typical solder used for microelectronic packaging is Sn-Pb alloy, which has the characteristics of low cost, good electrical conductivity, and excellent mechanical welding performance. However, lead and lead compounds are poisonous and harmful substances. Solder is harmful to human health in the process of production and use, and it is easy to cause cancer. Soldering waste will also seriously pollute the environment. With the enhancement of environmental awareness, EU WEEE, RoHS and other lead ban laws have been implemented one after another. my country's "Administrative Measures for the Prevention and Control of Pollution by Electronic Information Products" also stipulates that lead-free solder will be implemented from July 1, 2006. The s...

Claims

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Application Information

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IPC IPC(8): B23K35/26
Inventor 朱朋武
Owner NINGBO ZHUOCHENG SOLDER TECH
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