Method for plating metal layer by virtue of ionodialysis chemistry

A dialysis chemical and metal plating technology, which is applied in the field of ion dialysis chemical plating metal layer, can solve the problems of difficult processing and short service life of the plating solution, and achieve the effects of improving the quality of the plating layer, maintaining process stability, and simplifying preparation and maintenance

Inactive Publication Date: 2011-10-12
董季汉
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to overcome the short service life of the plating solution in the traditional electroless plating metal layer technology and the difficulty in post-treatment of the discarded plating solution, the ion dialysis chemical plating metal layer technology proposed by the present invention has the advantages of simplifying the preparation and maintenance of the electroless metal plating layer plating solution, maintaining Beneficial effects of process stabilization and improvement of coating quality

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  • Method for plating metal layer by virtue of ionodialysis chemistry
  • Method for plating metal layer by virtue of ionodialysis chemistry
  • Method for plating metal layer by virtue of ionodialysis chemistry

Examples

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Embodiment 1

[0014] Embodiment one ion dialysis electroless nickel plating

[0015] Figure 2 , the ion dialysis electroless nickel plating process on the substrate is:

[0016] S1, configure bath solution.

[0017] In the main salt tank 1, a main brine solution containing nickel ions of a certain concentration is prepared. Preferred nickel salts include nickel chloride, nickel sulfate, and the like. The preferred nickel salt concentration is 10 g / L to saturation in aqueous solution.

[0018] In the reaction tank 3, a tank solution including a reducing agent, a complexing agent, and a pH buffering agent is prepared. The preferred reducing agent includes sodium hypophosphite, and the preferred concentration of sodium hypophosphite is 10g / L-50g / L. Preferred complexing agents include citric acid, lactic acid, malic acid, etc., and the preferred complexing agent concentration is 5g / L-30g / L. The preferred pH buffering agent includes sodium acetate, etc., the preferred concentration of the...

Embodiment 2

[0025] Embodiment two ion dialysis electroless copper plating

[0026] Figure 2 , the ion dialysis electroless copper plating process on the substrate is:

[0027] S1, configure bath solution.

[0028] In the main salt tank 1, a main brine solution containing copper ions of a certain concentration is prepared. Preferred copper salts include copper chloride, copper sulfate, and the like. The preferred copper salt concentration is 10 g / L to saturation in aqueous solution.

[0029] In the reaction tank 3, a tank solution including a reducing agent, a complexing agent, and a pH buffering agent is prepared. The preferred reducing agent includes sodium hypophosphite, and the preferred concentration of sodium hypophosphite is 10g / L-50g / L. Preferred complexing agents include citric acid, lactic acid, malic acid, etc., and the preferred complexing agent concentration is 5g / L-30g / L. The preferred pH buffering agent includes sodium acetate, etc., the preferred pH buffering agent c...

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Abstract

The invention provides a method for plating a metal layer by ionodialysis chemistry. An ionodialysis plating bath is provided; the plating bath comprises a main salt tank 1 and a traction tank 3; and the main salt tank 1 and the reaction tank 3 are separated by a cation exchange membrane 2. Main salt containing coating metal ions is dissolved in the main slat tank 1; an ionic reducing agent is dissolved in the reaction tank 3; and additive agents such as a coating metal ion complexing agent, a pH value buffer and the like are added in the reaction tank 3. The solution in the reaction tank is heated to the working temperature and the pH value is adjusted; and after being subjected to preplating such as surface washing and surface activation, a substrate to be plated is placed into the reaction tank so as to be plated.

Description

technical field [0001] The invention belongs to the field of electroless metal plating, in particular to an ion dialysis electroless metal plating method. Background technique [0002] Electroless metallized layers have certain advantages over electroplated metallized layers. For example, the chemical plating metal layer has good uniformity and small porosity. Especially electroless nickel plating, as a functional coating, has better corrosion resistance and wear resistance than electroplating nickel layer, so electroless nickel plating has been widely used in mechanical and electronic industries. [0003] The current conventional electroless metal plating technology is to dissolve the salt of the metal to be plated and the reducing agent in the same container to prepare a plating solution with a certain concentration ratio. At the same time, in order to ensure the stability of the plating solution and the processability of plating, An appropriate amount of stabilizers, bu...

Claims

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Application Information

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IPC IPC(8): B01D61/26C23C18/16
Inventor 董季汉
Owner 董季汉
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