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High-dispersing nanometer silver and high-performance conductive adhesive

A high-dispersion, nano-silver technology, used in conductive adhesives, non-polymer adhesive additives, dyeing polymer organic compounds, etc., can solve the problems of backward level and late research start.

Inactive Publication Date: 2011-09-28
中科广化(重庆)新材料研究院有限公司 +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is a pity that domestic research in this area started late and the level is backward. At present, the high-performance conductive adhesives required mainly rely on imports. Competitiveness

Method used

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  • High-dispersing nanometer silver and high-performance conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] 1. Preparation of highly dispersed granular nano silver

[0084] (1) Under anhydrous and oxygen-free conditions, add mercaptoethanol to 20ml of chloroform and triethylamine, and add dibromoisobutyryl bromide under stirring at 25°C, wherein triethylamine, dibromoisobutyryl bromide The molar ratio of bromine to mercaptoethanol was 2:2:1, stirred and reacted at 0°C for 24 hours, then added 20ml of water, then extracted the product of the reaction with toluene, and then washed the product with saturated ammonium chloride solution 4 Once again, dry with anhydrous sodium sulfate, and then vacuum dry to obtain ATRP initiator A containing mercapto groups.

[0085] (2) Control the reaction temperature to be 25°C, then slowly add the silver nitrate aqueous solution to the hydrazine hydrate solution, the silver nitrate drop rate is: 0.5ml / min, the stirring speed of the reaction system is 800rpm, after the silver nitrate dropwise , ATRP initiator A was immediately added to the rea...

Embodiment 2

[0103] 1. Preparation of highly dispersed linear nano-silver

[0104] (1) Under anhydrous and oxygen-free conditions, add mercaptododecanol to 20ml of dichloromethane and triethylamine, and add dibromoisovaleryl bromide under stirring at 15°C, wherein triethylamine, dibromoisovaleryl bromide The molar ratio of valeryl bromide to mercaptododecanol is 1.5:2:1, stirred and reacted at 8°C for 16 hours, then added 20ml of water, extracted the reaction product with toluene, and then used saturated ammonium chloride The product was washed with the solution for 4 times, then dried with anhydrous magnesium sulfate, and then vacuum-dried to obtain ATRP initiator B containing mercapto groups.

[0105](2) Get 20mL of silver nitrate propylene glycol solution with a molar concentration of 0.22mol / L, slowly add it to 20mL of propylene glycol solution containing 1.2g polyvinylpyrrolidone and 0.1g sodium chloride, the rate of addition is 1mL / min, and the stirring speed is 1000rpm, the reactio...

Embodiment 3

[0121] 1. Preparation of highly dispersed rod-shaped silver nanoparticles

[0122] (1) Under anhydrous and oxygen-free conditions, add mercaptooctaol to 20ml of toluene and amphetamine, and add 2-bromopropionyl bromide under stirring at 35°C, wherein amphetamine, 2-bromopropionyl bromide The molar ratio with mercaptooctaol is 1:2.5:1, stirred and reacted at 16°C for 8 hours, then added 20ml of water, extracted the reaction product with toluene, and washed the product 4 with saturated ammonium chloride solution Once again, dry it with anhydrous magnesium sulfate, and then vacuum-dry it to obtain ATRP initiator C containing mercapto groups.

[0123] (2) get 20mL molar concentration and be the silver nitrate propylene glycol solution of 0.22mol / L, slowly join in 20mL the propylene glycol solution that contains 12g polyvinylpyrrolidone and 0.1g sodium sulfide, the rate of addition is 1mL / min, and stirring speed is 1000rpm, The reaction temperature was 180°C. After the silver nitr...

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Abstract

The invention discloses high-dispersing nanometer silver and a high-performance conductive adhesive. A preparation method for the high-performance conductive adhesive comprises the following steps of: mixing an epoxy resin curing agent and an accelerating agent uniformly; mixing the high-dispersing nanometer silver and epoxy resin uniformly; and dripping a mixture of the epoxy resin curing agent and the accelerating agent into a mixed component of the high-dispersing nanometer silver and the epoxy resin, which are being mixed, at the temperature of between 10 and 25 DEG C, and mixing for 3 to 10 hours to obtain the high-performance conductive adhesive. The nanometer silver can be fixed in the epoxy resin and has the excellent dispersibility in the epoxy resin, and the conductive adhesive prepared from the nanometer silver can fix a conductive network in the conductive adhesive, improve electric conductivity and solve the problem of silver migration in the using process of conductive silver. In addition, in epoxy resin of the high-performance conductive adhesive, four epoxy resin combinations with different functions are adopted, so the defects of insufficient bonding strength and shear strength in the current conductive adhesive are overcome.

Description

technical field [0001] The invention belongs to the field of electronic materials, in particular to a conductive adhesive, in particular to a highly dispersed nano-silver and a high-performance conductive adhesive. Background technique [0002] In today's world, science and technology are constantly developing, people's living standards are constantly improving, and electronic products are playing an increasingly important role in human's daily study, work and life. [0003] Integrated circuits (ICs for short) are almost the basis of modern electronic products. However, ICs cannot be assembled into a complete electronic product without connecting materials (Interconnection Materials). Because the connecting material is a bridge that connects various electronic components into a complete electronic product, its main function is to realize the transmission of signals, energy, and optoelectronics between electronic components. [0004] There are three main types of connecting ...

Claims

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Application Information

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IPC IPC(8): C09J11/04C09J9/02C09J163/02C09C3/10C09J163/00C08F292/00C09C1/62C09J163/04
Inventor 胡继文邹海良李银辉刘锋肖定书胡美龙
Owner 中科广化(重庆)新材料研究院有限公司
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