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Thermoplastic polyimide adhesive film as well as preparation method and application thereof

A polyimide film, polyimide technology, applied in the direction of adhesives, film/sheet adhesives, etc., can solve the problem of high bonding temperature, high hot-melt temperature of the film, and easy generation of adhesive surfaces. Air holes and other problems, to achieve the effect of simple process, easy operation, excellent room temperature and high temperature bonding performance

Active Publication Date: 2013-06-12
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high melting temperature of the adhesive film, in order to achieve sufficient infiltration with the surface to be bonded, the bonding temperature is as high as 350-375°C
Moreover, although the partially imidized adhesive film can improve the wettability of the adhered surface, due to the release of water molecules during the bonding process, the bonding surface is prone to produce pores and cause defects.

Method used

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  • Thermoplastic polyimide adhesive film as well as preparation method and application thereof
  • Thermoplastic polyimide adhesive film as well as preparation method and application thereof
  • Thermoplastic polyimide adhesive film as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Embodiment 1, prepare polyimide adhesive film

[0040] In a three-neck round bottom flask equipped with mechanical stirring, nitrogen inlet and thermometer, 42 parts of 1,4-bis(4'-amino-2'-trifluoromethylphenoxy)benzene (6FAPB) and 24 parts 4,4'-sulfonyl diphenylamine (4,4'-DADPS) was added to 550 parts of m-cresol, and stirred for 0.5 hours. Add 60 parts of 3,3',4,4'-diphenylmethyl ether tetra-acid dianhydride (ODPA) and 1.2 parts of end-capping agent phthalic anhydride (PA) to 550 parts of m-cresol, and stir for 0.5 hours . The above solutions were mixed and stirred to obtain a homogeneous solution.

[0041] Add 50 parts of toluene and 8 parts of isoquinoline to the above homogeneous solution, raise the temperature to 180°C and react for 12 hours, then distill off the toluene, and stop heating when the temperature of the reaction system reaches 220°C.

[0042] Cool the reaction solution to 80°C and pour it into ethanol, collect the precipitated solid, wash repeated...

Embodiment 2

[0052] Embodiment 2, prepare polyimide adhesive film

[0053] In a three-necked round bottom flask equipped with mechanical stirring, nitrogen inlet and thermometer, 135 parts of 1,4-bis(4'-amino-2'-trifluoromethylphenoxy)benzene (6FAPB) and 40 parts 3,3'-sulfonyldiphenylamine (3,3'-DADPS) was added to 1400 parts of N,N-dimethylformamide (DMF), and stirred for 0.5 hours. Add 150 parts of 3,3',4,4'-diphenylmethyl ether tetra-acid dianhydride (ODPA) and 3 parts of end-capping agent phthalic anhydride (PA) to 1400 parts of N-methylpyrrolidone (NMP) , stirred for 0.5 hours. The above solutions were mixed and stirred to obtain a homogeneous solution.

[0054] Add 125 parts of toluene and 20 parts of isoquinoline to the above homogeneous solution, heat up to 170°C and react for 10 hours, then distill off the toluene, and stop heating when the temperature of the reaction system rises to 210°C.

[0055] Cool the reaction solution to 80°C and pour it into methanol, collect the preci...

Embodiment 3

[0061] Embodiment 3, prepare polyimide film

[0062]In a three-neck round bottom flask equipped with mechanical stirring, nitrogen inlet and thermometer, 54 parts of 1,4-bis(4'-amino-2'-trifluoromethylphenoxy)benzene (6FAPB) and 27 parts 3,3'-Diaminobenzophenone (3,3'-DABP) was added to 650 parts of N-methylpyrrolidone (NMP), and stirred for 0.5 hours. Add 75 parts of 3,3',4,4'-diphenylmethyl ether tetra-acid dianhydride (ODPA) and 0.6 parts of end-capping agent phthalic anhydride (PA) to 650 parts of N-methylpyrrolidone (NMP) , stirred for 0.5 hours. The above solutions were mixed and stirred to obtain a homogeneous solution.

[0063] Add 60 parts of toluene and 10 parts of isoquinoline to the above homogeneous solution, raise the temperature to 190°C and react for 10 hours, then distill off the toluene, and stop heating when the temperature of the reaction system reaches 210°C.

[0064] The reaction solution was cooled to 80° C. and then poured into water. The precipitate...

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Abstract

The invention discloses a thermoplastic polyimide adhesive film as well as a preparation method and application thereof. A structural formula of a polymer for manufacturing the adhesive film is as shown in a formula I in the specification. The preparation method comprises the following steps of: (1) uniformly mixing aromatic diamine, aromatic tetracid dianhydride and a blocking agent in an organic solvent to obtain a homogeneous solution, then adding methylbenzene and isoquinoline to be mixed uniformly, heating to 170-190 DEG C and reacting for 10-24 hours to evaporate the methylbenzene, stopping heating after heating a reaction system to above 200 DEG C, precipitating after cooling to 80-120 DEG C; and (2) dissolving the obtained polymer in an organic solvent to obtain a glue solution of polyimide, coating the glue solution of polyimide on a baseplate, and drying to obtain the polyimide adhesive film. The adhesive film has excellent room-temperature and high-temperature splicing performance when being used for splicing metal materials, resin composite materials and the like.

Description

technical field [0001] The invention relates to a thermoplastic polyimide film and its preparation method and application. Background technique [0002] Adhesives can be divided into solution, paste, film and so on according to their physical form. Among them, the film-like adhesive has the advantages of uniform thickness, accurate glue application, simple construction process, and can be used for large-area bonding, especially for the bonding of honeycomb sandwich structures, which is incomparable to other bonding forms. The advantages. Among the existing high-temperature-resistant adhesive films, modified epoxy adhesive films are widely used. However, due to their limited heat-resistant stability, the adhesive strength of this type of adhesive film usually decreases significantly when used above 200°C, and it is difficult to be used as an adhesive film. Structural bonding materials are applied. Due to its excellent heat resistance stability and high-temperature bonding ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C09J7/00C09J179/08
Inventor 范琳霍海涛杨士勇莫松
Owner INST OF CHEM CHINESE ACAD OF SCI
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