Curable particulate silicone composition, optically reflective material comprising curable particulate silicone composition, and production method for optically reflective material comprising curable particulate silicone composition
A silicone, curable technology, used in semiconductor/solid-state device manufacturing, optical components, other household appliances, etc., which can solve the problem of reduced linear expansion coefficient, handling workability, insufficient curing characteristics and gap filling, flexibility and Insufficient strength and toughness, etc., to achieve the effects of excellent flexibility and toughness, excellent handling workability, and excellent curing characteristics
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[0234] Next, the curable granular silicone composition of the present invention and its manufacturing method will be described in detail through examples and comparative examples. In addition, in the formula, Me, Ph, and Vi represent a methyl group, a phenyl group, and a vinyl group, respectively. In addition, for the curable silicone composition of each Example and Comparative Example, the softening point, melt viscosity, moldability, warpage of the molded product, storage elastic modulus and total light reflectance of the cured product were measured as follows, and the results were As shown in Table 1.
[0235] [Softening point of hot-melt silicone]
[0236] The heat-fusible silicone was placed on a hot plate set at 25° C. to 100° C., and the temperature at which it became liquefied was used as the softening point while checking the state with a scraper.
[0237] [Softening point of curable granular silicone composition]
[0238] The curable granular silicone composit...
reference example 1
[0248] When put into a 1L flask at 25°C, it is a white solid, with an average unit formula:
[0249] (PHSiO 3 / 2 ) 0.80 (Me 2 ViSiO 1 / 2 ) 0.20
[0250] 55 mass %-toluene solution 270.5 g of the represented resinous organopolysiloxane, with the formula:
[0251] HMe 2 SiO(Ph 2 SiO)SiMe 2 h
[0252]21.3 g (with respect to the resin 1 mole of vinyl groups in organopolysiloxane, 0.5 moles of silicon atoms bonded to hydrogen atoms in this component), and 1,3-divinyltetramethyldisiloxane complex of platinum 0.034 g of 1,3-diethylenetetramethyldisiloxane solution (content of platinum metal = about 4000 ppm) (the amount of platinum metal is 10 ppm by mass relative to this liquid mixture) was uniformly stirred at room temperature. Then, the temperature in the flask was raised to 100°C using an oil bath, and stirred for 2 hours under reflux of toluene to prepare a resinous organosiloxane derived from the above-mentioned resinous organopolysiloxane and a resinous organopolysilo...
reference example 2
[0254] Into a 500 mL four-neck round bottom flask equipped with a Dean-Stark apparatus connected to a thermometer, a Teflon (registered trademark) stirring blade, and a water-cooled condenser, and filled with toluene in advance, the average Unit type:
[0255] (PhSiO 3 / 2 ) n
[0256] (wherein, n is the positive number that the weight average molecular weight of this organopolysiloxane is 1500)
[0257] 318.6 g of the 56.5% by mass-toluene solution of the indicated organopolysiloxane. Heating at the reflux temperature of toluene for 30 minutes removed 0.54 g of water. Next, cool to 108°C, add 4.24 g (0.0187 mol) of a mixture of methyltriacetylsilane / ethyltriacetylsilane with a molar ratio of 1:1 and silanol-terminated methylbenzene at both ends of the molecular chain. 220 g (1.614 mol) of phenylpolysiloxane (polymerization degree = 181) was reacted at room temperature for 1 hour with 224.24 g of a methylphenylpolysiloxane mixture. The reaction mixture was heated under nit...
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