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Bubble-free yellowing resistant polyurethane electronic potting adhesive composition and preparation method thereof

A composition and polyurethane technology, applied in polyurea/polyurethane adhesives, chemical instruments and methods, adhesives, etc., can solve the problems of light strip short circuit, resin pulverization, poor resistance to sunlight and ultraviolet light, etc., and meet the technical requirements Performance requirements, reduced production costs, and the effect of excellent flexibility

Active Publication Date: 2011-09-07
厦门誉匠复合材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1. When the room temperature of the epoxy resin system is lower than 10°C, the encapsulation resin of the LED soft light strip will harden, cannot be bent or even broken, and the LED soft light strip cannot be constructed at low temperature
[0008] 2. In the environment where the temperature is higher than 50°C, the epoxy resin system will have poor toughness and breakage at the bend. In addition to affecting the appearance of the soft light strip, the waterproof performance of the LED soft light strip is also greatly affected
[0009] 3. The epoxy resin system has extremely poor resistance to sunlight and ultraviolet light. After the LED soft light strip is placed outdoors for half a month, the resin begins to turn light yellow. As the outdoor storage time prolongs, the color of the resin deepens
The light emitted by the LED lights of the soft light strips has problems such as chromatic aberration, darkening and black lights.
[0010] 4. After the epoxy resin system is placed outdoors for one year, the resin begins to powder, crack, etc.
In addition to affecting the luminous efficiency of the soft light strip, the powdered and cracked resin also greatly affects the waterproof performance of the LED soft light strip, which may lead to short circuit of the light strip
[0011] At present, there are some transparent polyurethane materials that are resistant to yellowing on the market, but when this material is applied to LED flexible strip lights and electronic circuit boards, delamination and air bubbles appear at the soldering position of the circuit board.

Method used

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Examples

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preparation example Construction

[0044] The preparation method of the polyurethane electronic potting compound composition of the present invention, wherein: the composition is two components, and each component is calculated by weight percentage.

[0045] The types of polyisocyanates are aliphatic polyisocyanates, alicyclic polyisocyanates and / or polyisocyanate derivatives and prepolymers of this type.

[0046] Aliphatic polyisocyanates are preferably hexamethylene diisocyanate (HDI), xylylene diisocyanate (XDI), tetramethylxylylene diisocyanate (TMXDI).

[0047] Cycloaliphatic polyisocyanates are preferably isophorone diisocyanate (IPDI), dicyclohexylmethane diisocyanate (hydrogenated MDI).

[0048] The polyisocyanate derivatives are preferably HDI biuret, HDI trimer, and IPDI trimer.

[0049]Polyisocyanate prepolymers are reaction products of aliphatic and / or cycloaliphatic polyisocyanates with active hydrogen-containing compounds.

[0050] The catalyst used in the potting composition of the present inve...

Embodiment 1

[0060] Preparation of active hydrogen-containing compound components: 65 parts of polyoxypropylene polyol (molecular weight 1000), 15 parts of 1,4-butanediol, 18.5 parts of plasticizer trioctyl trimellitate (TOM) by weight Add the percentage example into the reaction kettle, stir for about 1.0 to 3.0 hours at 85°C to 120°C, and a vacuum of 0.05Mpa to 0.1Mpa, then cool down. When the temperature drops to 55°C-65°C, add 1 part of organic zinc catalyst and 0.5 part of defoamer, mix well and discharge.

[0061] Preparation of components containing isocyanate groups: Add 25 parts of polyester polyol (molecular weight: 2000) and 30 parts of polyether polyol (molecular weight: 3000) into the reaction kettle, raise the temperature to 85°C-120°C, and the vacuum degree is 0.05Mpa- Under the environment of 0.1Mpa, stir for 1.0-2.0 hours to remove water vapor. After cooling down to about 65°C to 85°C, add 45 parts of hexamethylene diisocyanate (HDI), react in an environment of 65°C to 85...

Embodiment 2

[0063] Preparation of active hydrogen-containing compound components: 70 parts of polyoxypropylene polyol (molecular weight 1000), 12 parts of 1,4-butanediol, and 16.5 parts of plasticizer diethylene glycol dibenzoate are followed by weight percentage Add it into the reaction kettle, stir for about 1.0 to 3.0 hours at 85°C to 120°C and a vacuum of 0.05Mpa to 0.1Mpa, and then cool down. When the temperature drops to about 55℃~65℃, add 1 part of organic zinc catalyst and 0.5 part of defoamer, mix well and discharge.

[0064] Preparation of components containing isocyanate groups: Add 30 parts of polyester polyol (molecular weight: 2000) and 10 parts of trimethylolpropane (molecular weight: 134) into the reaction kettle, raise the temperature to 85°C-120°C, and the vacuum degree is 0.05Mpa Under the environment of ~0.1Mpa, stir for 1.0~2.0 hours to remove water vapor. After cooling down to about 65°C-85°C, add 60 parts of hexamethylene diisocyanate (HDI), react in an environment...

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Abstract

The invention relates to a bubble-free yellowing resistant polyurethane electronic potting adhesive composition and a preparation method thereof. The raw material of the composition is a double-component system which mainly comprises a polyatomic alcohol compound, a polyisocyanate compound and other accessory agents with favorable weather resistance; and the proportion of the mole equivalent weight of an isocyanate group to the mole equivalent weight of an active hydrogen compound component in the system is 1.0:0.8-1.0:1.5. The composition disclosed by the invention solves the problems of yellowing, embrittlement, hardening, breakage, and the like which are generated after long-term use, of the traditional transparent potting adhesive; the potting adhesive composition is produced by adopting the raw materials with favorable weather resistance and a special synthesis process; the composition also has excellent weather resistance, and the product can not generate the adverse phenomena after long-term use; and the composition can be applied to a flexible printed circuit board LED soft strip light bar products with extremely high requirements on bending performance and yellowing resistant performance and can be also greatly applied to the industries of optical devices, photoelectric and solar cell panels, and the like in quantity.

Description

technical field [0001] The invention discloses a polyurethane electronic potting adhesive composition without bubbles and anti-yellowing and a preparation method thereof, which belongs to the technical field of manufacturing polyurethane potting adhesive compositions according to the International Patent Classification (IPC). The polyurethane electronic potting adhesive of the present invention The composition can be applied to the surface encapsulation of flexible printed circuit board LED flexible strip lights, and can also be applied to the surface encapsulation of products such as optical components and solar panels. Background technique [0002] Many products that are used outdoors and have a long service life require all parts of the product to have stable performance, especially for products that require high light transmittance. Some products that use potting glue, such as optoelectronics, LED soft light strips, solar panels, etc., have extremely high requirements on...

Claims

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Application Information

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IPC IPC(8): C08G18/78C08G18/66C08G18/48C08K5/12C08K5/11C09J175/08C09K3/10
Inventor 童华德
Owner 厦门誉匠复合材料有限公司
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