Method for preparing wide-working-temperature-zone thermostabilization composite dielectric ceramic

Abstract

The invention discloses a method for preparing wide-working-temperature-zone thermostabilization composite dielectric ceramic. The method comprises the following steps of: (1) according to the formula of x(Na0.5Bi0.5)TiO3-(1-X)BaTiO3, preparing bismuth nitrate solution and sodium acetate solution, wherein x is more than 0.01 and less than 0.5; preparing tetrabutyl titanate solution, and dropwise adding the bismuth nitrate solution and the sodium acetate solution into tetrabutyl titanate solution to obtain sodium bismuth titanate sol; (2) preparing barium titanate solution; (3) preparing (Na0.5Bi0.5)TiO3-BaTiO3 composite sol; (4) preparing xerogel; (5) preparing (Na0.5Bi0.5)TiO3-BaTiO3 composite nano powder; and (6) pelleting and performing compression moulding, sintering at the temperature of between 950 and 1,050 DEG C to obtain the composite dielectric ceramic. The nano powder prepared by a sol-gel method has a fine particle size, and the average grain diameter of the powder is 100nm; and the powder has high activity and sintering property, and the wide-working-temperature-zone thermostabilization composite dielectric ceramic with high dielectrical property can be prepared at low sintering temperature.

Description

technical field [0001] The invention belongs to the field of electronic information materials and components, and in particular relates to a preparation method of thermally stable dielectric ceramics in a wide working temperature range. Background technique [0002] In recent years, with the rapid development of aerospace, information, and medical equipment, the application fields of spacecraft, satellites, missiles, aircraft engines, tanks, and some VLSIs require electronic system equipment to be able to withstand various harsh environmental conditions ( Working temperature range: -55℃~+200℃) to work normally. This requires electronic components to have better stability and reliability under a wide operating temperature. Relevant studies have proved that for every 10°C increase in the normal operating temperature range of electronic components, the reliability will increase by 25%. Thermally stable (ΔC / C≤±15%) dielectric ceramic material. [0003] The X7R and X8R types h...

AI Technical Summary

Problems solved by technology

) Dielectric ceramic materials are far from meeting the high reliability requirements of modern electronic equipment in harsh environments due to their narrow operating temperature range

The main reason for its narrow working temperature range is that the research and development of X7R and X8R dielectric ceramic systems mainly focus on the traditional known materials (BaTiO 3 ) doping modification to move or broaden the Curie peak to achieve high dielectric constant and capacity temperature stability, but after all, simply use doped modified ions to BaTiO 3 (abbreviated as BT) has limited movement and broadening of the Curie peak (125°C), and cannot meet the standard of wide temperature (-55°C~+200°C) thermal stability

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