Method for passivating P-type doping layer of N-type silicon solar cell and cell structure
A technology of silicon solar cells and doped layers, applied in circuits, photovoltaic power generation, electrical components, etc., can solve problems such as complex processes, high costs, and unsuitability for large-scale industrial production
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[0034] A method for passivating a P-type doping layer of an N-type silicon solar cell, wherein a floating junction is formed on the emitter of a non-metallic grid line region of a P-type emitter junction on the backside of an N-type Czochralski monocrystalline silicon substrate through a phosphorus diffusion layer, The floating junction and the back metal gate line are separated by a dielectric film, and the surface of the floating junction is used as a passivation film.
[0035] The specific implementation steps are as follows:
[0036] a) The silicon wafer is cleaned, the damaged layer is removed, the surface is alkali-textured, and the reflectivity is 7%;
[0037] b) The boron source diffuses to form a P-type emitter junction with a square resistance of 40ohm / sq;
[0038] c) The acid etching solution corrodes the P-type emitter junction on the front side to form a single-sided P-type emitter junction;
[0039] d) 5% HF acid to remove BSG borosilicate glass;
[0040] e) T...
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