Halogen-free soldering flux
A flux and halogen technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve problems such as non-conformity, environmental hazards, and halogen residues, and achieve low post-weld corrosion, high safety performance, The effect of saving extra expenses
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Embodiment 1
[0042] This embodiment is a halogen-free flux, including the following components:
[0043] Organic acid 5%;
[0044] Hydroxyaminocarboxylic acid 2.5%;
[0045] Glycolic Acid 5%;
[0046] Surfactant 0.5%;
[0047] Corrosion inhibitor 0.1%;
[0048] Organic solvent balance;
[0049] Above-mentioned percentage is mass percentage;
[0050] The organic acid is succinic acid; the hydroxyaminocarboxylic acid is β-amino-α-hydroxycarboxylic acid; the surfactant is butylphenol polyoxyethylene ether; the corrosion inhibitor is benzotriazepam Azole; Described organic solvent is dehydrated alcohol.
[0051] The relevant materials and parameters of this embodiment are shown in Table 1.
Embodiment 2 to Embodiment 6
[0053] Embodiment 2 to Embodiment 6 are basically the same as Embodiment 1, except that the proportion of the components is different from that of Embodiment 1, and the relevant materials and parameters of Embodiment 2 to Embodiment 6 are shown in Table 1.
[0054] Table 1
[0055]
Embodiment 7
[0057] This embodiment is a halogen-free flux, including the following components:
[0058] Organic acid 5%;
[0059] Hydroxyaminocarboxylic acid 2.5%;
[0060] Glycolic Acid 5%;
[0061] Surfactant 0.5%;
[0062] Corrosion inhibitor 0.1%;
[0063] Organic solvent balance;
[0064] Above-mentioned percentage is mass percentage;
[0065] The organic acid is adipic acid; the hydroxyaminocarboxylic acid is α-hydroxycarboxylic acid amide; the surfactant is octylphenol polyoxyethyl ether; the corrosion inhibitor is α-mercaptobenzothiazole; Described organic solvent is ethylene glycol benzoxazole.
[0066] The relevant materials and parameters of this embodiment are shown in Table 2.
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