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Halogen-free soldering flux for lead-free solder paste

A lead-free solder and flux technology, used in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of few documents or patents, and rare halogen-free fluxes, etc., to improve welding performance, Improves insulation resistance and promotes wetting

Active Publication Date: 2011-07-20
HAIMEN THE YELLOW SEA ENTREPRENEURSHIP PARK SERVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are not many studies on halogen-free fluxes for lead-free solder paste, and there are few reported documents or patents

Method used

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  • Halogen-free soldering flux for lead-free solder paste
  • Halogen-free soldering flux for lead-free solder paste
  • Halogen-free soldering flux for lead-free solder paste

Examples

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preparation example Construction

[0019] A preparation method for lead-free solder paste with halogen-free flux, comprising the following steps:

[0020] 1) Add the high boiling point solvent into a clean enamel kettle with stirring, then crush the modified rosin and add it to the solvent, heat, stir, dissolve and clarify;

[0021] 2) Then add thixotropic agent, thickener, pH regulator, surfactant, chelating agent in sequence, stir until all solid substances are dissolved, finally add antioxidant, mix well, put it in a 5-liter beaker and seal it to stand. Halogen-free flux for lead-free solder paste obtained by cooling in ice water.

Embodiment 1

[0024] The formulation of the halogen-free flux is as follows:

[0025] Raw material parts by mass

[0026] Modified rosin KE604 26

[0027] polymerized rosin 135 10

[0028] Malonic acid 0.5

[0029] Adipic acid 1.0

[0030] Cyclohexanediacetic acid 3.0

[0031] Lauric acid 6.0

[0032] Ethylene bis stearic acid amide 4.0

[0033] Hexyl bishydroxystearic acid amide 4.5

[0034] Hydrogenated Castor Oil 2.0

[0035] Dehydrated Castor Oil 2.0

[0036] Benzomelamine 1.0

[0037] Glycerides of Hydrogenated Rosin 4.0

[0038] EB-7 0.5

[0039] Diphenylguanidine 1.0

[0040] Antioxidant 1010 1.0

[0041] Dynol604 0.5

[0042] Chelating agent Tekuran DO 0.15

[0043] Dimethyl itaconate 7.0

[0044] Diethylene glycol hexyl ether 25.85

Embodiment 2

[0046] The formulation of the halogen-free flux is as follows:

[0047] Raw material parts by mass

[0048] Modified rosin KE604 33

[0049] polymerized rosin 135 12

[0050] Malonic acid 0.5

[0051] Adipic acid 2.0

[0052] Cyclohexanediacetic acid 2.0

[0053] Lauric acid 2.0

[0054] Lauric acid 4.0

[0055] Ethylene bis stearic acid amide 3.0

[0056] Hexyl bishydroxystearic acid amide 4.0

[0057] Hydrogenated castor oil 1.5

[0058] Dehydrated castor oil 1.5

[0059] Erucamide 0.5

[0060] Benzomelamine 0.3

[0061] Glycerides of Hydrogenated Rosin 5.0

[0062] EB-7 0.2

[0063] Triisopropanolamine 1.0

[0064] Benzotriazole 0.5

[0065] Surfynol 465 0.2

[0066] Surfynol 604 0.2

[0067] Chelating agent Tekuran DO 0.2

[0068] Dimethyl itaconate 6.0

[0069] Diethylene glycol hexyl ether 20.4

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Abstract

The invention discloses a halogen-free soldering flux for lead-free solder paste, which comprises the following raw materials in part by mass: 8 to 12 parts of organic acid activator, 36 to 50 parts of modified rosin, 9.9 to 13.5 parts of thixotropic agent, 1.5 to 8.8 parts of tackifier, 0.5 to 2 parts of antioxidant, 0.5 to 2 parts of pH regulator, 0.2 to 1 part of surfactant, 0.1 to 0.3 part ofchelant and 10.4 to 48.7 parts of organic solvent. The soldering flux does not contain halogen compounds, is environment-friendly, can obviously improve dielectric resistance of residue after soldering, promotes wetting and improves the welding performance of the solder paste; in addition, the solder paste containing the soldering flux ensures that the residue after soldering is light in color and clear.

Description

[0001] technical field [0002] The invention relates to a halogen-free flux for lead-free solder paste. Background technique [0003] Environmental protection, energy saving and low carbon have gradually become the development trend of the future industry. In the field of electronic circuit packaging technology, lead-free and halogen-free solder paste conforms to this trend and is gradually becoming the focus of people's attention and research. The SnPb halogen-containing solder paste used in large quantities is contrary to the requirements of environmental protection. The Pb in it will bring great harm to the environment. If people absorb too much lead from the polluted environment, the central nervous system and liver will be damaged. Larger impact, and heavy metal Pb excretion from the human body is a long process. [0004] The halogen compounds contained in the flux, one of the main components of solder paste, play a role in increasing the soldering effect. However, wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/36
Inventor 罗时中赵跃高承仲
Owner HAIMEN THE YELLOW SEA ENTREPRENEURSHIP PARK SERVICE CO LTD
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