Gold bonding wire and preparation method thereof

Abstract

The invention discloses a gold bonding wire which comprises the following components in percentage by weight: 0.0003-0.0008 percent of calcium, 0.002-0.004 percent of copper, 0.0005-0.0015 percent of germanium and the balance of gold, wherein the purity of the gold is larger than or equal to 99.99 weight percent. The invention also discloses a preparation method of the gold bonding wire. The method mainly comprises the following step of after a wire drawing step and before an annealing step: loading a gold wire obtained after wire drawing into a high-pressure water washing system for washing,wherein the water pressure of the washing system is 2-4kg, i.e. 0.2-0.4MPa, and the water temperature is 40-60 DEG C. The gold bonding wire has the advantages of high strength and low and long arc and can meet the high requirement on gold bonding wires of the semiconductor industry; and moreover, in the preparation process, lubricating agents on the surfaces of the gold bonding wires can be effectively washed, therefore, the use effect of a final product is guaranteed.

Description

technical field [0001] The invention relates to the technical field of bonding wires, in particular to a bonding gold wire and a preparation method thereof. Background technique [0002] Bonding gold wire is the key lead material for the connection of integrated circuit or transistor chip die and lead frame. In recent years, with the rapid development of the semiconductor industry, the integration of integrated circuits is getting higher and higher, the thickness of the circuit board is getting smaller and smaller, the number of electrodes on the device is increasing, the distance between the electrodes is getting narrower, and the packaging density is also corresponding It is becoming smaller and smaller, and the objective requirement is that the bonding gold wire used as the lead wire has high strength, low long arc and very high arc stability. At present, the bonding gold wire mainly uses elements such as beryllium, cerium, and silver as the trace elements of the alloy. ...

AI Technical Summary

Problems solved by technology

At present, the bonding gold wire mainly uses elements such as beryllium, cerium, and silver as the trace elements of the alloy. These trace elements can refine the grain and strengthen the gold. High demands on long arcs

[0003] Moreover, in the preparation process of the existing bonded gold wires, it is generally necessary to heat them to 300~600°C for annealing, and after annealing, they are directly wound on the take-up spool for coiling. At this time, self-diffusion between the bonded gold wires is easy The sticking effect makes it impossible to release the thread in the next process, resulting in a large number of broken threads, and the product yield is not high, so the winding length of the take-up shaft is limited.

[0004] Generally, in the production process of bonded gold wire, the viscosity of the lubricating liquid used in the coarse and medium drawing processes of wire drawing is relatively high, and more lubricating liquid will remain on the surface of the gold wire after wire drawing. If it is directly annealed without treatment, Residual lubricating fluid will affect the surface cleanliness of the finished product line, further affecting the use effect of the final product

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