Large-scale welding method for carbon nano tube devices

Abstract

The invention relates to a large-scale welding method for carbon nano tube devices. A carbon nano tube is deposited on a wafer including a graphical electrode by adopting a dielectrophoresis method, the wafer is placed on a carrying table of a radio-frequency induction heating system for heating for a short time, the wafer is cooled under the condition of vacuum or protective gas, a heating coil is set according to an electrode pattern. The welding method includes the following steps of: A. dispersing carbon nano tubes; B. connecting a positioning and orientating bridge of the nano tubes between an electrode pair; and C. connecting the carbon nano tubes with the electrode in a welding manner. The large-scale welding method has the advantages of adopting a radio-frequency induction heating method, being simple in process, fast in welding speed, good in repeatability and high in reliability, and being capable of realizing production on a large scale, and realizing large-scale effective welding of the wafer-level carbon nano tube devices.

Description

technical field [0001] The invention relates to a micro-nano manufacturing method, in particular to a large-scale welding method between carbon nanotubes and metal electrodes. Background technique [0002] Carbon nanotubes have great application potential due to their excellent electrical, mechanical and thermal properties. in micro-nano devices. Much of the current research on carbon nanotube devices is focused on the prototyping of devices, such as field-effect transistors and carbon nanotube-based sensors, aimed at replacing some components in current electronic circuits. In addition, carbon nanotubes can be used as interconnecting wires of circuits and play an extremely important role in nanoelectronic devices. Therefore, the contact and welding between carbon nanotubes and metal electrodes has become an important issue in the fabrication of carbon nanotube nanodevices. However, many early manufacturing processes of carbon nanotube devices simply deposited carbon nano...

AI Technical Summary

Problems solved by technology

However, many early manufacturing processes of carbon nanotube devices simply deposited carbon nanotubes on the surface of metal electrodes without reliable welding, which resulted in poor mechanical strength and high contact resistance between carbon nanotubes and electrodes.

These shortcomings hinder the practical application of carbon nanotubes in the field of micro-nano electronic devices

In order to achieve effective welding contact between carbon nanotubes and metal electrodes, many researchers have tried many methods, such as welding carbon nanotubes and metal electrodes at the contact area of ​​carbon nanotubes and metals by electron beam and ion beam irradiation, according to this The contact resistance of this method can be reduced by several orders of magnitude, but this method is not easy to realize large-scale application due to its difficult process.

In addition, the rapid thermal annealing method has also been proven to reduce contact resistance. In this method, the entire substrate including carbon nanotubes, patterned electrodes and other device components is placed in an ambient temperature as high as 600-800 ° C. This high temperature will Severely limits the optional use of other materials on the substrate

Recently, ultrasonic welding technology has realized welding between carbon nanotubes and metal electrodes. This welding method presses carbon nanotubes on the metal electrodes through an ultrasonic probe. Although this method can obtain lower contact resistance, the welding process is easy. damaged electrode

Therefore, this method has the same disadvantage, that is, only a single part can be welded at a time, and it cannot be applied to the manufacture of large-scale carbon nanotube devices.

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