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Epoxy resin composite and covering film prepared from same

A technology of epoxy resin and brominated epoxy resin, applied in the direction of epoxy resin glue, adhesive type, conjugated diene adhesive, etc., can solve the properties of adhesive flexibility, heat resistance and peel strength Decrease, adhesive heat resistance, flame retardant storage period decline and other problems, to achieve excellent heat resistance, improve peel strength, improve the effect of flexibility

Active Publication Date: 2011-06-15
东莞海丽化学材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the flexibility of the adhesive, the general practice is to increase the amount of nitrile rubber. However, if the amount of carboxyl-terminated nitrile rubber is too large, the heat resistance, flame retardancy, and storage period of the adhesive will decrease; if the bromine content of the system is increased. Improve the flame retardancy, but also reduce the flexibility, heat resistance and peel strength of the adhesive

Method used

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  • Epoxy resin composite and covering film prepared from same
  • Epoxy resin composite and covering film prepared from same
  • Epoxy resin composite and covering film prepared from same

Examples

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preparation example Construction

[0054] Preparation of the above-mentioned cover film: a liquid dispersion of the composition of the present invention is formed by mixing the required components with an organic solvent, and the dispersion is coated on a polyimide film using a coating device; The insulating film of the body is passed through an online drying oven, heated at 80-160°C for 2 to 8 minutes, thereby removing the organic solvent and drying the composition to form a layer containing the composition in a semi-cured state, and then at 70-100°C Laminated with release paper, a highly flexible halogen-free cover film can be obtained.

[0055] The amount of glue overflow, softness, peel strength, heat resistance and flame retardancy of the halogen-free cover film made above were tested, as described in the following examples.

[0056] The embodiments of the present invention are described in detail as follows, but the present invention is not limited to the scope of the embodiments.

Embodiment 1

[0058] Brominated epoxy resin (trade name DER530-A80, manufactured by DOW Company, epoxy equivalent 425-440g / eq, solid content 80%) 56.3 parts by weight, brominated epoxy resin (trade name Epiclon153-60M, Dainippon Ink Co., Ltd. Made by the company, epoxy equivalent 390-410g / eq, solid content 60%) 36.7 parts by weight, rubber modified epoxy resin (trade name HyPox RF928, manufactured by U.S. CVC company, epoxy equivalent 200-225g / eq, rubber content 20 %) 8.0 parts by weight, carboxyl-terminated nitrile rubber (trade name Nipol 1072CGX, manufactured by U.S. ZEON company, solid content 100%) 25.0 parts by weight, high flexibility amine curing agent (trade name ELASMER-1000P, Japan IharaChemical Industry Co., LTD.) 4.3 parts by weight, 2.6 parts by weight of dicyandiamide, 0.15 parts by weight of 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN), aluminum hydroxide (trade name OL-104 / WE, manufactured by Albemarle, USA) 25.0 parts by weight and antioxidant (product model 1010, ma...

Embodiment 2

[0060] Brominated epoxy resin (trade name DER530-A80, manufactured by DOW Company, epoxy equivalent 425-440g / eq, solid content 80%) 56.3 parts by weight, brominated epoxy resin (trade name Epiclon153-60M, Dainippon Ink Co., Ltd. Made by the company, epoxy equivalent 390-410g / eq, solid content 60%) 36.7 parts by weight, rubber modified epoxy resin (trade name HyPox RF928, manufactured by U.S. CVC company, epoxy equivalent 200-225g / eq, rubber content 20 %) 8.0 parts by weight, carboxyl-terminated nitrile rubber (trade name Nipol 1072CGX, manufactured by U.S. ZEON company, solid content 100%) 25.0 parts by weight, high flexibility amine curing agent (trade name ELASMER-1000P, Japan IharaChemical Industry Co., LTD. manufacture) 6.4 parts by weight, dicyandiamide 2.4 parts by weight, 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN) 0.15 parts by weight, aluminum hydroxide (trade name OL-104 / WE, manufactured by Albemarle, USA) 25.0 parts by weight and antioxidant (product model 10...

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Abstract

The invention provides an epoxy resin composite and a covering film prepared from the same. The epoxy resin composite comprises brominated epoxy resin, rubber modified epoxy resin, chemigum, a high-flexibility amine curing agent, a latency amine curing agent, a curing promoter, an antioxidant, an inorganic padding and an organic solvent. The covering film prepared from the epoxy resin composite comprises a polymide film, an epoxy resin composite layer coated on the polymide film and release paper coated on the epoxy resin composite layer. In the epoxy resin composite, the high-flexibility amine curing agent and the latency amine curing agent are used as a compound curing system; and the flexibility of the composite is effectively improved while the storage life and the heat resistance are ensured, thus the dosage of the chemigum and the content of the bromine in the composite can be reduced, thus the peel strength, heat resistance and the like of the covering film are improved. The covering film prepared by the epoxy resin composite has the advantages of excellent heat resistance, flexibility, peel strength, longer storage life and suitability for flexibility printed circuits.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition and a cover film for a flexible printed circuit prepared by using the epoxy resin composition. Background technique [0002] The cover film for flexible printed circuit is a film-like insulating material coated on one side with glue on the insulating base film such as polyimide film or polyester film, which covers all or part of the outer surface of the flexible printed circuit board. The insulating protective layer on the conductive pattern not only plays the role of solder resistance, but also prevents the circuit from being polluted by dust, moisture and chemicals and other forms of damage. The effect of stress in the process improves the flex resistance of flexible printed circuit boards. [0003] In the current industry, the most widely used cover film is polyimide film cover film, which is formed by coating a layer of adhesive on one side of polyimid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C08L9/02C08G59/50C08L63/02C08L63/00C09J109/02C09J7/02H05K1/02C09J163/00
Inventor 茹敬宏刘生鹏
Owner 东莞海丽化学材料有限公司
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