TO-CAN coaxial small-sized packaging method for PIN-FET high-sensitivity detector

Abstract

The invention relates to a method for manufacturing a semiconductor photoelectric device for an inertial navigation system, in particular to a TO-CAN coaxial small-sized packaging method for a PIN-FET high-sensitivity detector. The method comprises the following steps that: a, the surface of a TO-CAN base made of an iron, nickel and cobalt alloy material is gilded and a heat-conductive Case point is arranged on a TO-CAN base welded with a ceramic heat sink; b, the surface of the ceramic heat sink is gilded by a thin-film sputtering method, and the ceramic heat sink is welded on the TO-CAN base by epoxy resin solder; c, an integrated chip, a detector PD chip and a filter capacitor are welded on the TO-CAN base by the epoxy resin solder; and d, a connecting chip is connected with an external connecting lead by welding a gold wire. Three fragmented components of FET, PNP and NPN are integrated on a chip, so that the device small in size is conveniently packaged into a TO-CAN coaxial small-sized device, and has the advantages of small size and low power consumption compared with the device packaged by the traditional butterfly packaging method.

Description

technical field [0001] The invention relates to the manufacture of semiconductor optoelectronic devices used in inertial navigation systems, in particular to a TO-CAN coaxial miniaturized packaging method for PIN-FET high-sensitivity detectors. Background technique [0002] At present, the miniaturization requirements for inertial navigation fiber optic gyroscopes are getting higher and higher, but the existing optoelectronic devices cannot meet the requirements for the miniaturization of the overall volume of fiber optic gyroscopes. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a TO-CAN coaxial miniaturization packaging method of a PIN-FET high-sensitivity detector that can reduce the volume of the photoelectric device and reduce power consumption. [0004] The method of the present invention is: [0005] a. Gold-plate the surface of the TO-CAN base made of iron-nickel-cobalt alloy material, and set a Case po...

AI Technical Summary

Problems solved by technology

[0002] At present, the requirements for miniaturization of inertial navigation fiber optic gyroscope are getting higher and higher, and the existing optoelectronic devices cannot meet the requirements of miniaturization of the overall volume of fiber optic gyroscope.