Bottom filling glue for packaging inverted chip type semiconductor

Abstract

The invention discloses bottom filling glue for packaging an inverted chip type semiconductor, which is prepared from the following raw materials in percentage by weight: 5.8-59 percent of liquid epoxy resin, 2-10 percent of rubber toughening agent, 5.8-59 percent of modified organic silicon resin, 0.5-14.8 percent of multifunctional epoxy resin, 1.5-10.5 percent of epoxy diluent, 0.5-14.8 percent of aromatic amine curing agent, 1.1-10.8 percent of silane coupling agent, 20-59 percent of silicon micropowder and 0-6 percent of pigment. The invention has the advantages of low viscosity, proper flow property, no defect, no bubble and good heat resistance of resin condensate, low thermal expansion coefficient, low modulus, small internal stress, less warping degree, high bonding strength, low halogen content and high insulating performance, can maintain favorable bonding reliability and curing performance during thermal cycling treatment and improve the seal performance and the operating performance of the surface of a silicon wafer containing photosensitive polyimide and a silicon nitride film, can be widely used for the technical field of inverted chip packaging and is especially suitable for the field of high-end devices in a Flip-chip process and high-density packaging.

Description

technical field [0001] The invention relates to an underfill adhesive for semiconductor packaging, in particular to an epoxy resin type underfill adhesive for flip-chip semiconductor packaging, [0002] It has low viscosity, excellent workability, and has good sealing properties for silicon crystals including photosensitive polyimide, silicon nitride film, aluminum oxide film, etc. Background technique [0003] More than 30 years ago, IBM first proposed the concept of flip-chip (Flip-chip) interconnection technology, which interconnects the chip face-down with the substrate, so that the bumps become the solder joints between the chip electrodes and the substrate wiring layer for firm welding. It offers higher packing density, shorter interconnection distances, better electrical performance and higher reliability. In recent years, with the development of C4 (Controlled Collapse Chip Connection) technology, Flip chip has become a major packaging technology. Flip-Chip is not ...

AI Technical Summary

Problems solved by technology

[0006] In order to solve the technical problem that the comprehensive performance of the existing epoxy underfill is not ideal enough, the present invention provides an epoxy resin with proper fluidity, low curing temperature, fast curing speed, no defects, no bubbles in the cured resin, and heat-resistant performance. Good, low thermal expansion coefficient, low modulus, high adhesive strength, small internal stress, small warpage and other comprehensive performance characteristics of liquid epoxy underfill for Flip-chip to meet the requirements of modern electronic packaging technology