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Method for manufacturing negative temperature coefficient (NTC) thermosensitive chip for high-precision temperature sensor

A technology of temperature sensor and manufacturing method, which is applied to thermometers, thermometers and instruments using electric/magnetic elements directly sensitive to heat, and can solve problems such as aging, electrical performance drift, and poor stability between semiconductor ceramics and metal electrodes

Active Publication Date: 2011-03-30
ZHUHAI EXENSE MEDICAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 2. Poor stability: The semiconductor ceramic body between the two electrodes of the manufactured NTC thermal chip is exposed, and it is easy to cause aging between the semiconductor ceramic and the metal electrode in harsh environments such as moisture, salt spray, air oxidation, and corrosive gases. , resulting in a drift in electrical performance

Method used

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  • Method for manufacturing negative temperature coefficient (NTC) thermosensitive chip for high-precision temperature sensor
  • Method for manufacturing negative temperature coefficient (NTC) thermosensitive chip for high-precision temperature sensor
  • Method for manufacturing negative temperature coefficient (NTC) thermosensitive chip for high-precision temperature sensor

Examples

Experimental program
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Effect test

Embodiment 1

[0050] This embodiment is illustrated by taking a disc-type NTC thermistor with a resistance value of 10Ω and a diameter of 9mm as an example: image 3 , Figure 4 As shown, the production steps are: (1) preparation of NTC heat-sensitive semiconductor ceramic powder; (2) strip molding / sintering; (3) glass packaging; (4) resistivity test; (5) size cutting; ( 6) Upper electrode.

[0051] specifically is:

[0052] 1. Preparation of NTC thermosensitive semiconductor ceramic powder 1 (preparation of NTC material with resistivity ρ=19.23Ω.cm)

[0053] Physical method (ball milling method) heat-sensitive semiconductor ceramic powder, its process is: batching (according to a specific formula) - ball milling - discharge - drying - sieving - pre-calcination - grinding - drying - sieving - powder for later use.

[0054] 2. Strip molding / sintering: the prepared NTC heat-sensitive ceramic powder 1 is placed in a mixing tank according to the weight ratio of porcelain powder: PVA binder = ...

Embodiment 2

[0066] This embodiment is illustrated by taking the manufacturing method of 0603~10KΩB(25 / 50)=3435K chip NTC thermistor as an example: it is basically the same as Embodiment 1, except that:

[0067] (1) The preparation method of the NTC thermosensitive semiconductor ceramic powder is made by the chemical method of sol-gel, and the specific steps are: preparation of sol-gelling-gel drying-calcination-NTC thermosensitive semiconductor Ceramic powder is available for use.

[0068] (2) Strip forming / sintering:

[0069] NTC thermosensitive ceramic rod (rod) isostatic pressing method:

[0070] Put the prepared NTC heat-sensitive ceramic powder in the rubber mold, loosely pack and vibrate;

[0071] Place it in an isostatic press, press with a pressure of 300-400Mpa for 30 minutes, release the pressure, and take it out from the mold;

[0072] High-temperature sintering: The pressed green ceramic ingot is slowly heated (1°C / min) to 1200±50°C in a high-temperature sintering furnace, ...

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Abstract

The invention belongs to the technical field of electronic parts and components, in particular to a method for manufacturing a negative temperature coefficient (NTC) thermosensitive chip for a high-precision temperature sensor, comprising the following steps: (1) preparing NTC thermosensitive semiconductor ceramic powder; (2) forming / sintering into a strip shape; (3) encapsulating by utilizing glass; (4) testing the resistivity; (5) cutting based on the size; and (6) adding terminal electrodes. As for the NTC thermosensitive chip manufactured by the method in the invention, in high-precision temperature measuring application occasions, the precision of the resistance R and the precision of the material constant B are controlled within 0.3%, namely the temperature precision can be controlled at 0.1% DEG C, and the annual drift rate of electric properties ( the resistance R and the material constant B) is less than 0.1% after the chip is utilized in an application circuit, thus the NTC thermosensitive chip can preferably ensure that high-precision resistance adjustments is realized, and has good stability preferably.

Description

technical field [0001] The invention belongs to the technical field of electronic components. Specifically disclosed is a method for manufacturing an NTC thermal chip for a high-precision temperature sensor. Background technique [0002] Thermistors and temperature sensors composed of NTC thermal chips as the core and in different packages are widely used in various temperature detection, temperature compensation, and temperature control circuits. The central role of signaling. [0003] With the development of electronic technology, various electronics are further multi-functional and intelligent, and the application of NTC thermal chips in various occasions that need to detect, control, and compensate temperature is increasing. At the same time, due to the need for high-precision temperature detection and temperature control of electronic equipment, higher and higher requirements are put forward for the accuracy and stability of the R resistance value and B value (materia...

Claims

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Application Information

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IPC IPC(8): G01K7/22
Inventor 段兆祥杨俊柏琪星唐黎明叶建开黄亚桃
Owner ZHUHAI EXENSE MEDICAL TECH
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