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Manufacture method of microporous or micro-slit array body and product

A manufacturing method and microporous technology, applied to parts of lighting devices, sound-generating devices, lighting devices, etc., can solve the problems of chemical corrosion liquid pollution of the environment, high processing costs, and inability to process corrosion-resistant plates, etc., and achieve long mold life , high processing efficiency and easy ejection effect

Inactive Publication Date: 2011-03-23
吴哲
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This processing method makes it possible to process extremely micropores in thin plates, but the processing cost is high, and corrosion-resistant plates such as thick plates and plastics cannot be processed, and chemical corrosion liquid pollutes the environment

Method used

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  • Manufacture method of microporous or micro-slit array body and product
  • Manufacture method of microporous or micro-slit array body and product
  • Manufacture method of microporous or micro-slit array body and product

Examples

Experimental program
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Effect test

specific Embodiment approach 1

[0032] Such as figure 1 Shown, a kind of manufacturing method of microhole or microslit array body, comprises the following steps:

[0033] (1) Prepare one of the following three kinds of materials: plastic, soft materials or dispersed state powders, aggregates and other materials 1; or liquid, fluid, amorphous materials 2; or plastic rough blanks 3. The above three materials have processing and curing properties such as hot-melt, thermoplastic, thermosetting, adhesive, gelling, self-setting, and sinterable.

[0034] (2) Feeding materials to the mold under suitable working conditions, including the temperature, humidity, pressure, etc. of rough blanks, working materials, and molds.

[0035] (3) Use a mold to process the rough blank or work material, wherein the male mold 4 has a core 5 on it, clamps the mold with the female mold 7 according to the direction 6, and injects or presses the work material into the mold.

[0036] (4) curing the formed array matrix and micropores o...

specific Embodiment approach 2

[0038] Such as figure 2 As shown, the "mold" described in step (3) has adopted a "variable cross-section" mold core 5a, and its cross-sectional area is gradually reduced from the root 9 to the top 10, and the cross-sectional area of ​​the micropore or micro-slit 11 is also correspondingly changed by the hole, seam The surface 12 tapers towards the depth 13 . The advantage of doing this is that since the mold core becomes a cone, it is very beneficial to demoulding, and the demoulding can be carried out smoothly by adopting auxiliary demoulding measures such as vibration.

specific Embodiment approach 3

[0039] Such as figure 2 As shown, when the material adopts a microporous material with appropriate acoustic resistance, the mold core does not need to penetrate the bottom 14 of the micropore or microslit array body 8 to form a very thin acoustic resistance layer. As a result, the tip of the mold core is protected, the precision requirement of the mold core manufacturing is reduced, the sound absorption efficiency is improved, and the micropore or microslit array body structure is simplified.

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Abstract

The invention discloses a manufacture method of a microporous or micro-slit array body and a product. The method comprises the following steps of: making a plastic rough blank or material; molding and processing by using a die; solidifying a formed array body substrate and microspores or micro slits; and obtaining the microporous or micro-slit array body. The cross section of a die core of the die in use is gradually reduced from the root to the top, the processed microporous or micro-slit cross section is correspondingly and gradually reduced, and an acoustic resistance layer is reserved between the microporous or micro-slit bottom and the substrate bottom. The manufactured microporous or micro-slit array body has the thickness larger than 5mm, and the material in use is transparent or light-transmitting. The product comprises illuminators which are arranged in the microspores or micro slits or behind the array body, distributed and connected according to patterns, characters or a matrix and driven by a preset program. The invention can once form and process microporous or micro-slit slabs of a plurality of inorganic or organic materials and can realize low material cost and low processing cost.

Description

technical field [0001] This patent belongs to the technical field of material processing, in particular to the technical field of micro-perforated or micro-perforated plate processing. Background technique [0002] As a fiber-free green sound-absorbing material, micro-perforated or micro-perforated panels are clean and heat-resistant, and have great market prospects. The main factors hindering the development and popularization of micro-perforated or micro-slotted plates are the difficulty and high cost of processing micro-holes or micro-slit arrays. [0003] The aperture is small (aperture D<1mm, the optimal aperture is 0.1-0.2mm), the number of pores is large (10000-80000 / m 2 ) challenges the difficulty, efficiency, mold life and cost of processing. [0004] It is more difficult to process thick plates. Tens of thousands of micro-holes or micro-slits are drilled on plates tens of millimeters thick. Mechanical and chemical processing cannot be done, and laser processin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G10K11/16B29C67/20B26F1/02B26F1/14F21V33/00
Inventor 吴哲李凌吴沛桦李志鹏
Owner 吴哲
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