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Empty micropin array chip, percutaneous dosing paster, device and manufacture method thereof

A hollow micro-needle array technology, which is applied in the field of medicine, medical and beauty equipment, can solve the problems of short effective treatment time, small dosage, unsuitable for liquid and ointment drugs, etc., to improve drug efficacy or beauty and beauty effects , Increased storage capacity, effective treatment time and improved cost performance

Active Publication Date: 2010-12-15
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the existing solid microneedle transdermal drug delivery patch has the disadvantages of small dosage, short effective treatment time, and being unsuitable for liquid and ointment drugs.

Method used

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  • Empty micropin array chip, percutaneous dosing paster, device and manufacture method thereof
  • Empty micropin array chip, percutaneous dosing paster, device and manufacture method thereof
  • Empty micropin array chip, percutaneous dosing paster, device and manufacture method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0079] Figure 1-Figure 12 Shows the hollow microneedle array chip provided by the present invention, the hollow microneedle array chip includes a substrate 1 and a number of hollow microneedles arranged on the substrate 1, the number of hollow microneedles are formed at a certain interval Hollow microneedle array, the hollow microneedles include needles 2 exposed on the surface of the substrate and needle shafts 3 embedded in the substrate, the needles 2 have an elliptical annular plane 4 and one end is a needle tip 5, each of the hollow microneedles The elliptical annular planes 4 of the needles are parallel to each other or arranged at a certain angle or at any angle. The hollow microneedles penetrate both sides of the substrate to form a through hole 6 or are closed at the bottom of the needle shaft to form a blind hole 6 . The substrate 1 may include an upper substrate 1a and a lower substrate 1b stacked together, and the needle bar 3 at least penetrates the upper substra...

Embodiment 2

[0094] Manufacturing method of hollow stainless steel microneedle array chip

[0095] Insert a hollow stainless steel needle tube with an outer diameter of 250 microns and a length of 2 mm in each hole of the through-hole array mold. The needle 2 has an elliptical annular plane 4, or the plane is cut off at least a section of arc surface to make it exist more edges and corners, and then insert the needle bar 3 vertically or inclined at a certain angle into the epoxy resin prepolymer solution used to prepare the epoxy resin substrate, and form the prototype of the microneedle array chip after heating, polymerization and curing. The substrate bottom side of the chip is ground and polished to the desired thickness, thus forming a figure 1 with Figure 3-9 A hollow stainless steel microneedle array chip on a single-layer rigid substrate is shown.

Embodiment 3

[0097] Manufacturing method of hollow stainless steel microneedle array chip

[0098] Insert a hollow stainless steel needle tube with an outer diameter of 250 microns and a length of 1.5 mm in each hole of the through-hole array mold, and the needle 2 has an elliptical annular plane 4, or the plane is at least cut off a section of arc surface to make it There are more edges and corners, and then the needle 2 is vertically or obliquely penetrated a piece of non-woven fabric 1a and protrudes 0.5 mm, and finally a piece of polyethylene plastic film 1b with a thickness of about 1 mm and coated with adhesive is combined with the above-mentioned non-woven fabric 1b. The spun cloth 1a is bonded to form a Figure 10 A hollow stainless steel microneedle array chip on a double-layer flexible substrate is shown.

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Abstract

The invention discloses an empty micropin array chip which comprises a substrate and an empty micropin, wherein the empty micropin comprises a pin head and a pin rod, the empty micropin is fixed on the substrate through the pin rod and is inclined to the substrate at a certain angle, the pin head is provided with an oval-shaped annular plane, one end of the pin head is a pinpoint, one part of the oval-shaped annular plane is embedded into the substrate, the pin rod is an empty circular pipe which is embedded into the substrate or is penetrated through the substrate, the bottom of the pin rod is parallel with the lower surface of the substrate or is convex or concave, and the empty micropin penetrates through the two sides of the substrate to be formed into the hole-shaped micropin or the bottom of the pin rod is sealed to be formed into a blind hole type micropin. The empty micropin array chip is firm in structure, sharp in pinpoint, convenient in puncture, low in cost, high in yield, and suitable for manufacture in bulk. The micropin in the array has good consistency, is free of pain feel and blooding when in use, and is safe and reliable since the minimally-invasive skin can fast heal after in use.

Description

technical field [0001] The invention relates to the technical fields of medicine, medical and cosmetic devices, in particular to a hollow microneedle array chip and a transdermal drug delivery patch, device and preparation method based on the chip. Background technique [0002] Human skin has three layers of tissue: stratum corneum, active epidermis and dermis. The thickness of the outermost stratum corneum is about 30-50 microns, and it is composed of dense corneocytes. Its permeability to most drugs is very low, which is the main obstacle to the transdermal delivery of these drugs; below the stratum corneum is the epidermis, The thickness is about 50-100 microns, containing living cells and a small amount of nerve tissue, but no blood vessels; below the epidermis is the dermis, which is the main component of the skin and contains a large number of living cells, nerve tissue and blood vessel tissue. The outer diameter of the needle used in the traditional subcutaneous inje...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61M37/00
CPCA61M37/0015A61M2037/0053A61M2037/0023
Inventor 岳瑞峰王燕
Owner TSINGHUA UNIV
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