Large-area liquid-cooled heat dissipation device

Abstract

The invention discloses a large-area liquid-cooled heat dissipation device which comprises a heat diffusion plate, an injecting liquid distributor, a plurality of heat absorption tubes and a drained-liquid collector, wherein a heat absorption surface of the heat diffusion plate is in contact with a plurality of heating sources; the plurality of heat absorption tubes are distributed on a heat dissipation surface of the heat diffusion plate and communicated with the injecting liquid distributor and the drained-water collector; each heat absorption tube is internally provided with a cooled liquid channel, and the cross-sectional areas of the cooled liquid channels of the plurality of heat absorption tubes are different, and the heat absorption tubes having the cooled liquid channels with larger cross-sectional areas correspond to the heating sources with higher temperature. Because the heat absorption tubes having the cooled liquid channels with larger cross-sectional areas are arranged corresponding to the heating sources with higher temperature, the heat absorption effect of the heating sources with higher temperature can be improved.

Description

technical field [0001] The invention relates to a large-area liquid-cooled heat dissipation device, in particular to a large-area liquid-cooled heat dissipation device that provides different heat dissipation effects according to heat dissipation requirements at different positions. Background technique [0002] At present, general computers, such as personal computers, servers, etc., have to deal with increasingly complex computing tasks, so the waste heat generated by multiple electronic components such as chips and semiconductor switches is extremely high. In order to cool these electronic components, usually Install a fan or a liquid-cooled heat sink on the electronic components to dissipate heat from the electronic components. [0003] To effectively dissipate heat from multiple heat-generating electronic components, refer to Figure 11 As shown, an existing large-area liquid-cooled heat dissipation device applied to servers includes a thermal diffusion plate 60 and a h...

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a large-area liquid-cooled heat dissipation device, which can provide different heat dissipation effects according to the heat dissipation requirements of different positions, so as to solve the problem of uneven heat dissipation effects of existing large-area liquid-cooled heat dissipation devices

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