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Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate

A technology for synthesizing resins and adhesives, applied in the direction of online phenolic epoxy resin adhesives, adhesives, epoxy resin glue, etc., which can solve the problems that no halogen-free phosphorus-free flame-retardant epoxy resin composition has been reported.

Inactive Publication Date: 2010-10-06
HAISO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent CN101381506A introduces a halogen-free and phosphorus-free flame-retardant epoxy resin composition and adhesive sheets and copper-clad laminates made of it, but the halogen-free and phosphorus-free flame-retardant epoxy resin composition is used in flexible cladding. Not reported in copper plate

Method used

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  • Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate
  • Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate
  • Halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for flexible copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] 30 parts of biphenyl epoxy resin (NC-3000H), 45 parts of elastomer modified epoxy resin (Epon58005), 10 parts of polyester resin (Vylon30P), 20 parts of synthetic rubber (Nipol 1072), melamine cyanurate 35 parts, 20 parts of aluminum hydroxide and 100 parts of methyl ethyl ketone are placed in a ball mill to fully grind, then add 10 parts of diaminodiphenyl sulfone, 1.0 parts of 2-ethyl 4-methylimidazole and 390 parts of methyl ethyl ketone, and continue stirring at high speed After 12 hours, adjust the solid content of the glue solution to 35±2wt%, and mix it into a halogen-free and phosphorus-free epoxy resin adhesive.

[0040]The adhesive is coated on a polyimide insulating film with a thickness of 25 μm by a coating machine, and the thickness of the coating is 20±2 μm, and then dried in an oven at 80 ° C for 10 minutes to remove the organic solvent, and 35 μm electrolytic copper foil The hot pressing rollers are combined together, and the composite is cured at 150°C...

Embodiment 2

[0042] The specific formula is shown in Table 1, Example 2, and the preparation method of the adhesive is the same as in Example 1. Apply the prepared adhesive on a polyimide insulating film with a thickness of 12.5 μm by a coating machine, and the thickness of the coating is 20 μm, and then dry it through a 100 ° C oven for 5 minutes to remove the organic solvent, and 35 μm electrolytic copper foil After being combined by hot pressing rollers, the composite was cured at 150°C for 2 hours and at 170°C for 2 hours to obtain a flexible copper-clad laminate, and its properties are shown in Table 2.

Embodiment 3

[0044] The specific formula is shown in Table 1, Example 3, and the preparation method of the adhesive is the same as in Example 1. The prepared adhesive is coated on a polyimide insulating film with a thickness of 25 μm by a coating machine. The hot pressing rollers are combined together, and the composite is cured at 150°C for 2 hours and at 170°C for 2 hours to obtain a flexible copper clad laminate, and its properties are shown in Table 2.

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Abstract

The invention relates to a halogen-free and phosphorous-free flame-retardant synthetic resin adhesive used for a flexible copper clad laminate, in particular to the adhesive used for producing the flexible copper clad laminate. The adhesive comprises the following components: biphenyl epoxy resin, elastomer modified epoxy resin, a flexibilizer, a curing agent, a curing accelerator, an inorganic filler and an organic solvent. The halogen-free and phosphorous-free flame-retardant synthetic resin adhesive is halogen-free and phosphorous-free, is environmental-friendly and achieves fire retardance up to level UL94V-0; and the flexible copper clad laminate produced by using the adhesive has the characteristics of high folding endurance, high fire retardance, dip-soldering resistance, high peel strength, low water absorption and high dimensional stability.

Description

technical field [0001] The invention relates to a halogen-free, phosphorus-free, flame-retardant synthetic resin adhesive, in particular to a halogen-free, phosphorus-free, flame-retardant epoxy resin adhesive for producing flexible copper-clad laminates. Background technique [0002] The traditional three-layer flexible copper clad laminate (FCCL) mainly uses brominated epoxy resin as the main body, and realizes its flame retardancy through bromine. Although this can achieve excellent flame retardancy, when burning, not only smoke A large amount, and will produce corrosive and toxic hydrogen halide gas. It is also reported that substances such as carcinogenic dioxins and dibenzofurans have been detected in electronic equipment wastes containing halogens such as bromine. In 2006, two environmental protection directives promulgated by the European Union were officially implemented. In order to meet the green environmental protection requirements of "halogen-free substrate ma...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/04C09J11/06C09J11/08
Inventor 范和平刘刚
Owner HAISO TECH
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